Thermal Stress and Strain in Microelectronics Packaging
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a mo...
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| Format: | eBook |
| Language: | English |
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New York, NY
Springer US
1993, 1993
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| Edition: | 1st ed. 1993 |
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| Online Access: | |
| Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Table of Contents:
- 1. Thermomechanics for Electronics Packaging
- 2. Thermal Expansivity and Thermal Stress in Multilayered Structures
- 3. Thermal Stresses in Anisotropic Multilayered Structures
- 4. Transient Thermal Stresses in Multilayered Devices
- 5. Temperature Dependence of Thermal Expansion of Materials for Electronics Packages
- 6. Thermal Stress Considerations in Die-Attachment
- 7. Die Stress Measurement Using Piezoresistive Stress Sensors
- 8. Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry
- 9. Correlation of Analytical and Experimental Approaches to Determination of Thermally Induced Printed Wiring Board (PWB) Warpage
- 10. Thermal Stress-Induced Open-Circuit Failure in Microelectronics Thin-Film Metallizations
- 11. Thermal Stress and Stress-Induced Voiding in Passivated Narrow Line Metallizations on Ceramic Substrates
- 12. Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices
- 13. Thermal and Moisture Stresses in Plastic Packages
- 14. Solutions to Moisture Resistance Degradation During Solder Reflow of Plastic Surface Mount Components
- 15. Thermomechanical Fatigue of 63Sn-37Pb Solder Joints
- 16. A Prediction of the Thermal Fatigue Life of Solder Joints Using Crack Propagation Rate and Equivalent Strain Range
- 17. Microstructural Evaluation of Sn-Pb Solder and Pd-Ag Thick-Film Conductor Metallization Under Thermal Cycling and Aging Conditions
- 18. Solder Joint Reliability of Leadless Chip Carriers
- 19. Solder Creep-Fatigue Interactions with Flexible Leaded Surface Mount Components
- 20. Thermal Stress Issues in Plated-Through-Hole Reliability
- 21. Nonlinear Analysis of a Ceramic Pin Grid Array (PGA) Soldered to an Orthotropic Epoxy Substrate
- 22. Mechanics of Wirebond Interconnects
- 23. Corrosion in Microelectronics Packages
- Author Biographies