Advances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
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Format: | eBook |
Language: | English |
Published: |
New York, NY
Springer US
1962, 1962
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Edition: | 1st ed. 1962 |
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Online Access: | |
Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Physical Description: | XV, 328 p. 176 illus online resource |
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ISBN: | 9781489973115 |