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140122 ||| eng |
| 020 |
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|a 9781468477672
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| 100 |
1 |
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|a Lau, John
|e [editor]
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| 245 |
0 |
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|a Thermal Stress and Strain in Microelectronics Packaging
|h Elektronische Ressource
|c edited by John Lau
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| 250 |
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|a 1st ed. 1993
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| 260 |
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|a New York, NY
|b Springer US
|c 1993, 1993
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| 300 |
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|a XXIV, 884 p. 466 illus
|b online resource
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| 505 |
0 |
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|a 1. Thermomechanics for Electronics Packaging -- 2. Thermal Expansivity and Thermal Stress in Multilayered Structures -- 3. Thermal Stresses in Anisotropic Multilayered Structures -- 4. Transient Thermal Stresses in Multilayered Devices -- 5. Temperature Dependence of Thermal Expansion of Materials for Electronics Packages -- 6. Thermal Stress Considerations in Die-Attachment -- 7. Die Stress Measurement Using Piezoresistive Stress Sensors -- 8. Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry -- 9. Correlation of Analytical and Experimental Approaches to Determination of Thermally Induced Printed Wiring Board (PWB) Warpage -- 10. Thermal Stress-Induced Open-Circuit Failure in Microelectronics Thin-Film Metallizations -- 11. Thermal Stress and Stress-Induced Voiding in Passivated Narrow Line Metallizations on Ceramic Substrates -- 12. Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices -- 13. Thermal and Moisture Stresses in Plastic Packages -- 14. Solutions to Moisture Resistance Degradation During Solder Reflow of Plastic Surface Mount Components -- 15. Thermomechanical Fatigue of 63Sn-37Pb Solder Joints -- 16. A Prediction of the Thermal Fatigue Life of Solder Joints Using Crack Propagation Rate and Equivalent Strain Range -- 17. Microstructural Evaluation of Sn-Pb Solder and Pd-Ag Thick-Film Conductor Metallization Under Thermal Cycling and Aging Conditions -- 18. Solder Joint Reliability of Leadless Chip Carriers -- 19. Solder Creep-Fatigue Interactions with Flexible Leaded Surface Mount Components -- 20. Thermal Stress Issues in Plated-Through-Hole Reliability -- 21. Nonlinear Analysis of a Ceramic Pin Grid Array (PGA) Soldered to an Orthotropic Epoxy Substrate -- 22. Mechanics of Wirebond Interconnects -- 23. Corrosion in Microelectronics Packages -- Author Biographies
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| 653 |
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|a Science, Humanities and Social Sciences, multidisciplinary
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| 653 |
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|a Electronics and Microelectronics, Instrumentation
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| 653 |
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|a Electronics
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| 653 |
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|a Microelectronics
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| 041 |
0 |
7 |
|a eng
|2 ISO 639-2
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| 989 |
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|b SBA
|a Springer Book Archives -2004
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| 856 |
4 |
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|u https://doi.org/10.1007/978-1-4684-7767-2?nosfx=y
|x Verlag
|3 Volltext
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| 082 |
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|a 621.381
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| 520 |
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|a Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging
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