Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages...
| Main Authors: | , , |
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| Format: | eBook |
| Language: | English |
| Published: |
New York, NY
Springer US
2003, 2003
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| Edition: | 1st ed. 2003 |
| Series: | The Springer International Series in Engineering and Computer Science
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| Subjects: | |
| Online Access: | |
| Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Table of Contents:
- 1 Introduction
- 1.1 Numerical Modeling with Finite Element Analysis
- 1.2 Constitutive Relations
- 1.3 Failure Prediction
- 1.4 References
- 2 Thermomechanical Fatigue Life Prediction Analysis
- 2.1 Approach
- 2.2 Analysis Steps
- 2.3 Case Study: BGA-Type Package
- 2.4 References
- 3 Mechanical Bending Fatigue Life Prediction Analysis
- 3.1 Approach
- 3.2 Analysis Steps
- 3.3 Case Study: BGA-Type Package
- 3.4 References
- 4 Macro Reference Library
- 4.1 Overview
- 4.2 Preprocessor
- 4.3 Solution
- 4.4 Postprocessing
- 4.5 Reference
- Appendix A: Installation and Execution
- A.1 Steps for ReliANS Installation on a PC Platform
- A.2 Steps for Adding Working Directories for Use in ReliANS
- A.3 Demonstration of ReliANS Installation and Adding New Directories
- A.4 Installation of ReliANS on UNIX Systems
- Appendix B: Input Listings for Case Studies
- B. 1 Input Listing for the Case Study Given in Chapter 2
- B.2 Input Listing for the Case Study Given in Chapter 3