Madenci, E., Guven, I., & Kilic, B. (2003). Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (1st ed. 2003.). New York, NY: Springer US.
Chicago Style CitationMadenci, Erdogan, Ibrahim Guven, and Bahattin Kilic. Fatigue Life Prediction of Solder Joints in Electronic Packages With Ansys®. 1st ed. 2003. New York, NY: Springer US, 2003.
MLA CitationMadenci, Erdogan, Ibrahim Guven, and Bahattin Kilic. Fatigue Life Prediction of Solder Joints in Electronic Packages With Ansys®. 1st ed. 2003. New York, NY: Springer US, 2003.
Warning: These citations may not always be 100% accurate.