|
|
|
|
| LEADER |
02990nmm a2200349 u 4500 |
| 001 |
EB000623538 |
| 003 |
EBX01000000000000000476620 |
| 005 |
00000000000000.0 |
| 007 |
cr||||||||||||||||||||| |
| 008 |
140122 ||| eng |
| 020 |
|
|
|a 9781461502555
|
| 100 |
1 |
|
|a Madenci, Erdogan
|
| 245 |
0 |
0 |
|a Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
|h Elektronische Ressource
|c by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
|
| 250 |
|
|
|a 1st ed. 2003
|
| 260 |
|
|
|a New York, NY
|b Springer US
|c 2003, 2003
|
| 300 |
|
|
|a XX, 185 p
|b online resource
|
| 505 |
0 |
|
|a 1 Introduction -- 1.1 Numerical Modeling with Finite Element Analysis -- 1.2 Constitutive Relations -- 1.3 Failure Prediction -- 1.4 References -- 2 Thermomechanical Fatigue Life Prediction Analysis -- 2.1 Approach -- 2.2 Analysis Steps -- 2.3 Case Study: BGA-Type Package -- 2.4 References -- 3 Mechanical Bending Fatigue Life Prediction Analysis -- 3.1 Approach -- 3.2 Analysis Steps -- 3.3 Case Study: BGA-Type Package -- 3.4 References -- 4 Macro Reference Library -- 4.1 Overview -- 4.2 Preprocessor -- 4.3 Solution -- 4.4 Postprocessing -- 4.5 Reference -- Appendix A: Installation and Execution -- A.1 Steps for ReliANS Installation on a PC Platform -- A.2 Steps for Adding Working Directories for Use in ReliANS -- A.3 Demonstration of ReliANS Installation and Adding New Directories -- A.4 Installation of ReliANS on UNIX Systems -- Appendix B: Input Listings for Case Studies -- B. 1 Input Listing for the Case Study Given in Chapter 2 -- B.2 Input Listing for the Case Study Given in Chapter 3
|
| 653 |
|
|
|a Manufactures
|
| 653 |
|
|
|a Electrical engineering
|
| 653 |
|
|
|a Electronic materials
|
| 653 |
|
|
|a Electrical Engineering
|
| 653 |
|
|
|a Manufacturing, Machines, Tools, Processes
|
| 653 |
|
|
|a Optical materials
|
| 653 |
|
|
|a Optical and Electronic Materials
|
| 700 |
1 |
|
|a Guven, Ibrahim
|e [author]
|
| 700 |
1 |
|
|a Kilic, Bahattin
|e [author]
|
| 041 |
0 |
7 |
|a eng
|2 ISO 639-2
|
| 989 |
|
|
|b SBA
|a Springer Book Archives -2004
|
| 490 |
0 |
|
|a The Springer International Series in Engineering and Computer Science
|
| 856 |
4 |
0 |
|u https://doi.org/10.1007/978-1-4615-0255-5?nosfx=y
|x Verlag
|3 Volltext
|
| 082 |
0 |
|
|a 670
|
| 520 |
|
|
|a Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages
|