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Hybrid photonic assemblies based on 3D-printed coupling structures

Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...

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Bibliographic Details
Main Author: Xu, Yilin
Format: eBook
Language:English
Published: KIT Scientific Publishing 2023
Series:Karlsruhe Series in Photonics & Communications
Subjects:
Photonische Aufbau- Und Verbindungstechnik; Integrierte Photonische Schaltkreise; Multiphotonenlithographie; Additive 3d Mikrofabrikation; Mikrooptik; Photonic Packaging; Photonic Integrated Circuits (pic); Multi-photon Lithographie; Additive 3d Micro-fabrication; Micro-optics
Electrical Engineering
Online Access:
Collection: OAPEN - Collection details see MPG.ReNa
Description
Summary:Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
Item Description:Creative Commons (cc), https://creativecommons.org/licenses/by-sa/4.0/
Physical Description:292 p.
ISBN:KSP/1000154744

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