Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...

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Bibliographic Details
Main Author: Lindenmann, Nicole
Format: eBook
Language:English
Published: KIT Scientific Publishing 2018
Series:Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ)
Subjects:
Online Access:
Collection: Directory of Open Access Books - Collection details see MPG.ReNa
Description
Summary:To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
Item Description:Creative Commons (cc), https://creativecommons.org/licenses/by-sa/4.0/
Physical Description:1 electronic resource (XXI, 222 p. p.)
ISBN:9783731507468
1000077963