2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Format: | eBook |
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Published: |
New York
The Institute of Electrical and Electronics Engineers, Inc.
2022
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Subjects: | |
Online Access: | |
Collection: | IEEE Conference Proceedings - Collection details see MPG.ReNa |
ISBN: | 9781665458368 9781665458375 |
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