2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
| Format: | eBook |
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| Published: |
New York
The Institute of Electrical and Electronics Engineers, Inc.
2019
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| Collection: | IEEE Conference Proceedings - Collection details see MPG.ReNa |
| ISBN: | 9781538680407 9781538680414 |
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