2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Bibliographic Details
Format: eBook
Published: New York The Institute of Electrical and Electronics Engineers, Inc. 2019
Subjects:
Online Access:
Collection: IEEE Conference Proceedings - Collection details see MPG.ReNa
Description
ISBN:9781538680407
9781538680414