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210512 ||| eng |
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|a 9783036503349
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|a books978-3-0365-0335-6
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|a 9783036503356
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| 100 |
1 |
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|a Górecki, Krzysztof
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| 245 |
0 |
0 |
|a Latest Advances in Electrothermal Models
|h Elektronische Ressource
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| 260 |
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|a Basel, Switzerland
|b MDPI - Multidisciplinary Digital Publishing Institute
|c 2021
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| 300 |
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|a 1 electronic resource (140 p.)
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| 653 |
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|a thermal resistance
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| 653 |
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|a transient thermal impedance
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| 653 |
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|a finite-element method (FEM)
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| 653 |
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|a algorithm convergence analysis
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| 653 |
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|a inductors
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| 653 |
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|a SPICE
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| 653 |
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|a electrothermal model
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| 653 |
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|a self-heating
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| 653 |
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|a throughput improvement
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| 653 |
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|a electrothermal (ET) simulation
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| 653 |
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|a algorithm efficiency analysis
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| 653 |
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|a modelling
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| 653 |
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|a History of engineering and technology / bicssc
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| 653 |
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|a finite difference method scheme
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| 653 |
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|a model-order reduction (MOR)
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| 653 |
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|a IGBT
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| 653 |
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|a silicon carbide
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| 653 |
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|a silicon carbide (SiC)
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| 653 |
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|a DC-DC converter
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| 653 |
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|a Grünwald-Letnikov fractional derivative
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| 653 |
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|a multi-LED lighting modules
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| 653 |
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|a relative error analysis
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| 653 |
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|a thermal phenomena
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| 653 |
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|a thermal simulation algorithm
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| 653 |
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|a diode-transistor switch
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| 653 |
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|a thermal model
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| 653 |
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|a Dual-Phase-Lag heat transfer model
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| 653 |
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|a temperature sensors
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| 653 |
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|a Finite Difference Method scheme
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| 653 |
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|a device thermal coupling
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| 653 |
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|a Krylov subspace-based model order reduction
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| 653 |
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|a ferromagnetic cores
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| 653 |
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|a computational complexity analysis
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| 653 |
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|a power electronics
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| 653 |
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|a BJT
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| 653 |
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|a microprocessor
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| 653 |
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|a multicellular power MOSFET
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| 653 |
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|a thermal measurements
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| 653 |
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|a averaged model
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| 653 |
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|a compact thermal models
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| 700 |
1 |
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|a Górecki, Paweł
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| 700 |
1 |
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|a Górecki, Krzysztof
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| 700 |
1 |
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|a Górecki, Paweł
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| 041 |
0 |
7 |
|a eng
|2 ISO 639-2
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| 989 |
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|b DOAB
|a Directory of Open Access Books
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| 500 |
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|a Creative Commons (cc), https://creativecommons.org/licenses/by/4.0/
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| 024 |
8 |
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|a 10.3390/books978-3-0365-0335-6
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| 856 |
4 |
2 |
|u https://directory.doabooks.org/handle/20.500.12854/68490
|z DOAB: description of the publication
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| 856 |
4 |
0 |
|u https://www.mdpi.com/books/pdfview/book/3510
|7 0
|x Verlag
|3 Volltext
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| 082 |
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|a 900
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|a 000
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|a 600
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|a 620
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|a This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode-transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
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