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Latest Advances in Electrothermal Models

This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulati...

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Bibliographic Details
Main Author: Górecki, Krzysztof
Other Authors: Górecki, Paweł
Format: eBook
Language:English
Published: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute 2021
Subjects:
Thermal Resistance
Transient Thermal Impedance
Finite-element Method (fem)
Algorithm Convergence Analysis
Inductors
Spice
Electrothermal Model
Self-heating
Throughput Improvement
Algorithm Efficiency Analysis
Electrothermal (et) Simulation
History Of Engineering And Technology / Bicssc
Modelling
Finite Difference Method Scheme
Model-order Reduction (mor)
Igbt
Silicon Carbide
Silicon Carbide (sic)
Dc-dc Converter
Grünwald-letnikov Fractional Derivative
Multi-led Lighting Modules
Relative Error Analysis
Thermal Phenomena
Thermal Simulation Algorithm
Diode-transistor Switch
Thermal Model
Dual-phase-lag Heat Transfer Model
Temperature Sensors
Device Thermal Coupling
Krylov Subspace-based Model Order Reduction
Ferromagnetic Cores
Power Electronics
Computational Complexity Analysis
Bjt
Microprocessor
Multicellular Power Mosfet
Thermal Measurements
Averaged Model
Compact Thermal Models
Online Access:
Collection: Directory of Open Access Books - Collection details see MPG.ReNa
Description
Summary:This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode-transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
Item Description:Creative Commons (cc), https://creativecommons.org/licenses/by/4.0/
Physical Description:1 electronic resource (140 p.)
ISBN:9783036503349
books978-3-0365-0335-6
9783036503356

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