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210512 ||| eng |
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|a books978-3-03943-832-7
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|a 9783039438327
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|a 9783039438310
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|a Rencz, Márta
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| 245 |
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|a Thermal and Electro-thermal System Simulation 2020
|h Elektronische Ressource
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| 260 |
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|a Basel, Switzerland
|b MDPI - Multidisciplinary Digital Publishing Institute
|c 2021
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| 300 |
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|a 1 electronic resource (310 p.)
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| 653 |
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|a non-destructive testing
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| 653 |
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|a computation time
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| 653 |
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|a electronic packages
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| 653 |
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|a thermal resistance
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| 653 |
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|a Industry 4.0
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| 653 |
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|a LM-80
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| 653 |
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|a compact thermal model
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| 653 |
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|a Joint Electron Device Engineering Council (JEDEC) metrics
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| 653 |
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|a two-phase solver
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| 653 |
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|a rheology
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| 653 |
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|a SPICE
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| 653 |
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|a LED lifetime modelling
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| 653 |
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|a TM-21
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| 653 |
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|a thermal pads
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| 653 |
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|a beyond CMOS
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| 653 |
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|a self-heating
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| 653 |
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|a digital twin
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| 653 |
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|a microfluidics
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| 653 |
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|a power LED measurement and simulation
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| 653 |
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|a microchannels
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| 653 |
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|a optical efficiency
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| 653 |
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|a modelling
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| 653 |
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|a heat generation
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| 653 |
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|a History of engineering and technology / bicssc
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| 653 |
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|a solar energy
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| 653 |
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|a hotspot
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| 653 |
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|a measurements
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| 653 |
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|a thermal-aware task scheduling
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| 653 |
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|a Delphi4LED
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| 653 |
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|a TDTR
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| 653 |
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|a life testing
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| 653 |
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|a accuracy repeatability and reproducibility of thermal measurements
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| 653 |
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|a OpenFOAM
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| 653 |
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|a multi-domain modeling
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| 653 |
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|a LED multi-domain modelling
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| 653 |
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|a ROM
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| 653 |
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|a thermal phenomena
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| 653 |
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|a liquid cooling
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| 653 |
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|a nonlinear thermal model
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| 653 |
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|a pulse transformer
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| 653 |
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|a thermal interface resistance
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| 653 |
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|a phosphor modeling
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| 653 |
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|a size effect
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| 653 |
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|a electronics cooling
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| 653 |
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|a finite volume method
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| 653 |
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|a CoB LEDs
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| 653 |
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|a digital luminaire design
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| 653 |
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|a thermal simulation
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| 653 |
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|a power LEDs
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| 653 |
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|a thermal modelling
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| 653 |
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|a detailed thermal model
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| 653 |
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|a magnetic nanoparticle
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| 653 |
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|a Spice-like modelling of LEDs
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| 653 |
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|a LED
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| 653 |
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|a AlGaN-GaN HEMT
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| 653 |
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|a phonon transport mechanisms
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| 653 |
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|a electro-thermal model
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| 653 |
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|a Light-emitting diodes
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| 653 |
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|a electro-thermal simulation
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| 653 |
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|a thermal-electronic circuits
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| 653 |
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|a VO2
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| 653 |
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|a vertical structure
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| 653 |
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|a BCI-DCTM
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| 653 |
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|a heat transfer mechanisms
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| 653 |
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|a lifetime extrapolation and modelling of LEDs
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| 653 |
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|a reliability testing
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| 653 |
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|a thermal impedance
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| 653 |
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|a module temperature
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| 653 |
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|a thermal testability
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| 653 |
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|a experimental validation
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| 653 |
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|a statistical analysis
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| 653 |
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|a thermal conductivity
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| 653 |
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|a BGA
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| 653 |
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|a thermal testing standards
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| 653 |
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|a CFD
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| 653 |
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|a lithium-ion battery
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| 653 |
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|a DVFS
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| 653 |
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|a thermal transient testing
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| 653 |
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|a modal approach
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| 653 |
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|a 3D IC
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| 700 |
1 |
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|a Codecasa, Lorenzo
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| 700 |
1 |
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|a Poppe, Andras
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| 700 |
1 |
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|a Rencz, Márta
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| 041 |
0 |
7 |
|a eng
|2 ISO 639-2
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| 989 |
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|b DOAB
|a Directory of Open Access Books
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| 500 |
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|a Creative Commons (cc), https://creativecommons.org/licenses/by/4.0/
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| 024 |
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|a 10.3390/books978-3-03943-832-7
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| 856 |
4 |
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|u https://www.mdpi.com/books/pdfview/book/3293
|7 0
|x Verlag
|3 Volltext
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| 856 |
4 |
2 |
|u https://directory.doabooks.org/handle/20.500.12854/68284
|z DOAB: description of the publication
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|a This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the "thermal and electro-thermal system simulation" Special Issue of Energies. These contributions present the latest results in a currently very "hot" topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
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