Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–21, 1964
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Format: | eBook |
Language: | English |
Published: |
New York, NY
Springer US
1965, 1965
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Edition: | 1st ed. 1965 |
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Online Access: | |
Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Physical Description: | VI, 297 p. 267 illus online resource |
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ISBN: | 9781489973078 |