Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–21, 1964
| Main Author: | |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY
Springer US
1965, 1965
|
| Edition: | 1st ed. 1965 |
| Subjects: | |
| Online Access: | |
| Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
| Physical Description: | VI, 297 p. 267 illus online resource |
|---|---|
| ISBN: | 9781489973078 |