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Manufacturing Challenges in Electronic Packaging

About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in...

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Bibliographic Details
Other Authors: Lee, Y.C. (Editor), Chen, W.T. (Editor)
Format: eBook
Language:English
Published: New York, NY Springer US 1998, 1998
Edition:1st ed. 1998
Subjects:
Electronics And Microelectronics, Instrumentation
Machines, Tools, Processes
Manufactures
Chemistry, Technical
Electronics
Industrial Chemistry
Online Access:
Collection: Springer Book Archives -2004 - Collection details see MPG.ReNa
Table of Contents:
  • 1. Manufacturing challenges in electronic packaging: an overview
  • 1.1 Introduction
  • 1.2 Industries and markets and applications segments
  • 1.3 Semiconductor technology trends and roadmap forecast
  • 1.4 Microelectronic packaging
  • 1.5 PCB manufacturing for organic packaging
  • 1.6 Assembly technology in manufacturing of electronic packages
  • 1.7 Conclusion
  • References
  • 2. Challenges in solder assembly technologies
  • 2.1 Introduction
  • 2.2 The interaction of soldering process with soldering materials
  • 2.3 Processing the challenges
  • 2.4 Soldering materials issues
  • 2.5 Summary and conclusions
  • References
  • 3. Testing and characterization
  • 3.1 Introduction
  • 3.2 Coefficient of thermal expansion
  • 3.3 Mechanical characterization of thin-film materials
  • 3.4 Tensile ductility of plated copper
  • 3.5 PTH cracking
  • 3.6 Warpage
  • 3.7 Solder strain
  • 3.8 Fracture toughness and crack propagation
  • 3.9 Adhesion and interfacial delamination
  • 3.10 Moisture
  • 3.11 Summary
  • References
  • 4. Design for manufacture and assembly of electronic packages
  • 4.1 Introduction
  • 4.2 General considerations
  • 4.3 Design guidelines for the manufacture of PCBs
  • 4.4 Design guidelines for the assembly of PCBs
  • 4.5 Estimating the assembly cost
  • 4.6 Case study
  • 4.7 Concluding remarks
  • References
  • 5. Process modeling, optimization and control in electronics manufacturing
  • 5.1 Introduction
  • 5.2 Physical models
  • 5.3 Empirical models
  • 5.4 Combined physical-empirical models
  • 5.5 Process optimization
  • 5.6 Run-by-run and real-time process control
  • 5.7 Concluding remarks
  • References
  • 6. Integrated manufacturing system for printed circuit board assembly
  • 6.1 Introduction
  • 6.2 Requirements of PCB assembly system
  • 6.3 Outline of integrated manufacturing system for PCB assembly
  • 6.4 Assembly process planning
  • 6.5 Assembly scheduling
  • References

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