Manufacturing Challenges in Electronic Packaging
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in...
Other Authors: | , |
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Format: | eBook |
Language: | English |
Published: |
New York, NY
Springer US
1998, 1998
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Edition: | 1st ed. 1998 |
Subjects: | |
Online Access: | |
Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Table of Contents:
- 1. Manufacturing challenges in electronic packaging: an overview
- 1.1 Introduction
- 1.2 Industries and markets and applications segments
- 1.3 Semiconductor technology trends and roadmap forecast
- 1.4 Microelectronic packaging
- 1.5 PCB manufacturing for organic packaging
- 1.6 Assembly technology in manufacturing of electronic packages
- 1.7 Conclusion
- References
- 2. Challenges in solder assembly technologies
- 2.1 Introduction
- 2.2 The interaction of soldering process with soldering materials
- 2.3 Processing the challenges
- 2.4 Soldering materials issues
- 2.5 Summary and conclusions
- References
- 3. Testing and characterization
- 3.1 Introduction
- 3.2 Coefficient of thermal expansion
- 3.3 Mechanical characterization of thin-film materials
- 3.4 Tensile ductility of plated copper
- 3.5 PTH cracking
- 3.6 Warpage
- 3.7 Solder strain
- 3.8 Fracture toughness and crack propagation
- 3.9 Adhesion and interfacial delamination
- 3.10 Moisture
- 3.11 Summary
- References
- 4. Design for manufacture and assembly of electronic packages
- 4.1 Introduction
- 4.2 General considerations
- 4.3 Design guidelines for the manufacture of PCBs
- 4.4 Design guidelines for the assembly of PCBs
- 4.5 Estimating the assembly cost
- 4.6 Case study
- 4.7 Concluding remarks
- References
- 5. Process modeling, optimization and control in electronics manufacturing
- 5.1 Introduction
- 5.2 Physical models
- 5.3 Empirical models
- 5.4 Combined physical-empirical models
- 5.5 Process optimization
- 5.6 Run-by-run and real-time process control
- 5.7 Concluding remarks
- References
- 6. Integrated manufacturing system for printed circuit board assembly
- 6.1 Introduction
- 6.2 Requirements of PCB assembly system
- 6.3 Outline of integrated manufacturing system for PCB assembly
- 6.4 Assembly process planning
- 6.5 Assembly scheduling
- References