Modeling and Application of Flexible Electronics Packaging

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illust...

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Main Authors: Huang, YongAn, Yin, Zhouping (Author), Wan, Xiaodong (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Singapore Springer Singapore 2019, 2019
Edition:1st ed. 2019
Subjects:
Online Access:
Collection: Springer eBooks 2005- - Collection details see MPG.ReNa
Summary:This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics
Physical Description:XVII, 287 p online resource
ISBN:9789811336270