Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge res...
Main Authors: | , |
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Format: | eBook |
Language: | English |
Published: |
Cham
Springer International Publishing
2014, 2014
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Edition: | 1st ed. 2014 |
Subjects: | |
Online Access: | |
Collection: | Springer eBooks 2005- - Collection details see MPG.ReNa |
Table of Contents:
- Introduction
- Wafer Stacking and 3D Memory Test
- Built-in Self-Test for TSVs
- Pre-Bond TSV Test Through TSV Probing
- Pre-Bond TSV Test Through TSV Probing
- Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths
- Post-Bond Test Wrappers and Emerging Test Standards
- Test-Architecture Optimization and Test Scheduling
- Conclusions