Copper Electrodeposition for Nanofabrication of Electronics Devices

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...

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Bibliographic Details
Other Authors: Kondo, Kazuo (Editor), Akolkar, Rohan N. (Editor), Barkey, Dale P. (Editor), Yokoi, Masayuki (Editor)
Format: eBook
Language:English
Published: New York, NY Springer New York 2014, 2014
Edition:1st ed. 2014
Series:Nanostructure Science and Technology
Subjects:
Online Access:
Collection: Springer eBooks 2005- - Collection details see MPG.ReNa
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245 0 0 |a Copper Electrodeposition for Nanofabrication of Electronics Devices  |h Elektronische Ressource  |c edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi 
250 |a 1st ed. 2014 
260 |a New York, NY  |b Springer New York  |c 2014, 2014 
300 |a VIII, 282 p. 190 illus., 75 illus. in color  |b online resource 
505 0 |a Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating 
653 |a Electrochemistry 
653 |a Electrochemistry 
653 |a Solid State Physics 
653 |a Electronics and Microelectronics, Instrumentation 
653 |a Electronics 
653 |a Nanotechnology 
653 |a Microelectronics 
653 |a Nanotechnology 
653 |a Solid state physics 
700 1 |a Akolkar, Rohan N.  |e [editor] 
700 1 |a Barkey, Dale P.  |e [editor] 
700 1 |a Yokoi, Masayuki  |e [editor] 
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989 |b Springer  |a Springer eBooks 2005- 
490 0 |a Nanostructure Science and Technology 
856 4 0 |u https://doi.org/10.1007/978-1-4614-9176-7?nosfx=y  |x Verlag  |3 Volltext 
082 0 |a 541.37 
520 |a This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners