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Copper Electrodeposition for Nanofabrication of Electronics Devices

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...

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Bibliographic Details
Other Authors: Kondo, Kazuo (Editor), Akolkar, Rohan N. (Editor), Barkey, Dale P. (Editor), Yokoi, Masayuki (Editor)
Format: eBook
Language:English
Published: New York, NY Springer New York 2014, 2014
Edition:1st ed. 2014
Series:Nanostructure Science and Technology
Subjects:
Electrochemistry
Solid State Physics
Electronics And Microelectronics, Instrumentation
Electronics
Nanotechnology
Microelectronics
Online Access:
Collection: Springer eBooks 2005- - Collection details see MPG.ReNa
Table of Contents:
  • Copper Electrodeposition
  • Suppression Effect and Additive Chemistry
  • Acceleration Effect
  • Modeling and Simulation
  • Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects
  • Microstructure of Evolution of Copper in Nano-scale Interconnect Features
  • Direct Copper Plating
  • Through Silicon Via
  • Build-up Printed Wiring Boards
  • Copper Foil Smooth on Both Sides for Lithium Ion Battery
  • Through Hole Plating

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