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2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application

Bibliographic Details
Format: eBook
Published: New York The Institute of Electrical and Electronics Engineers, Inc. 2007
Subjects:
Computing And Processing; Components, Circuits, Devices And Systems; Engineered Materials, Dielectrics And Plasmas; Signal Processing And Analysis; General Topics For Engineers
Online Access:
https://ieeexplore.ieee.org/servlet/opac?punumber=...
Collection: IEEE Conference Proceedings - Collection details see MPG.ReNa
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ISBN:1424408962
9781509084982

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