2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
| Format: | eBook |
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| Published: |
New York
The Institute of Electrical and Electronics Engineers, Inc.
2007
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| Subjects: | |
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| Collection: | IEEE Conference Proceedings - Collection details see MPG.ReNa |
| ISBN: | 142441105X 9781509089604 |
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