2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Bibliographic Details
Format: eBook
Published: New York The Institute of Electrical and Electronics Engineers, Inc. 2007
Subjects:
Online Access:
Collection: IEEE Conference Proceedings - Collection details see MPG.ReNa
Description
ISBN:9781509089604
142441105X