Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)
| Format: | eBook |
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| Published: |
New York
The Institute of Electrical and Electronics Engineers, Inc.
2004
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| Collection: | IEEE Conference Proceedings - Collection details see MPG.ReNa |
| ISBN: | 0780386205 |
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