Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.
| Format: | eBook |
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| Published: |
New York
The Institute of Electrical and Electronics Engineers, Inc.
2006
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| Subjects: | |
| Online Access: | |
| Collection: | IEEE Conference Proceedings - Collection details see MPG.ReNa |
| ISBN: | 9781509093397 1424404886 |
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