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1
by Lau, John H.
Published 2018
Springer Nature Singapore
Table of Contents: “...Patent Issues of Fan-out Wafer-Level Packaging -- Flip Chip Technology vs. FOWLP -- Fan-In Wafer...”
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2
by Wu, Rong, Huijsing, Johan H., Makinwa, Kofi A.
Published 2013
Springer New York
Table of Contents: “... -- Read-Out Integrated Circuits -- Conclusions...”
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3
by Lau, John H.
Published 2024
Springer Nature Singapore
Table of Contents: “...-- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology...”
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4
by Desai, Jignesh Kumar P., Makwana, Vijay
Published 2023
Springer Nature Singapore
Table of Contents: “... -- Analysis of blackouts around the globe -- Adaptive Out of Step Protection of Synchronous Generator...”
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5
by Qin, Qinghua
Published 2013
Springer Berlin Heidelberg
Table of Contents: “...Introduction to Piezoelectricity -- Mathematical Foundation -- Piezoelectric Fibre Pull-Out...”
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6
by Hajji, Bekkay, Mellit, Adel, Bouselham, Loubna
Published 2022
Springer Nature Singapore
Table of Contents: “... machines -- Chapter 6: Memory Circuits -- Part III: Digital projects carried out on the FPGA platform...”
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7
Published 2017
Springer Berlin Heidelberg
Table of Contents: “... when to yield -- The "exclusively -- “Get out of my wind” -- Load, load monitoring, and load reduction...”
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8
by Banasiewicz, Andrew
Published 2021
Springer International Publishing
Table of Contents: “...Introduction -- Out with the Old In with the New -- Democratization of Organizations...”
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9
Published 2023
Springer Nature Singapore
Table of Contents: “... on Probability Calculation -- Precision Motion Control of Separate Meter-in and Separate Meter-out Hydraulic...”
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10
by Pamula, Venkata Rajesh, Van Hoof, Chris, Verhelst, Marian
Published 2019
Springer International Publishing
Table of Contents: “... Sampling (CS) Photoplethysmogram (PPG) Read-out With Embedded Feature Extraction -- Chapter6: Conclusions...”
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11
by Lau, John H.
Published 2021
Springer Nature Singapore
Table of Contents: “...-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC...”
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12
Published 2023
Springer International Publishing
Table of Contents: “...Advanced state of the art based on smart meters already carried out in Europe and around the world...”
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13
Published 2011
Springer US
Table of Contents: “...-Electrodes -- CMOS Read-out Circuits -- Low Power ADCs for Bio-medical Applications -- Low-Power Bio-Medical...”
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14
Published 2010
Springer US
Table of Contents: “... Data Coupling Technologies -- Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity...”
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15
Published 2019
Springer International Publishing
Table of Contents: “... Protocols Using Scenario Based Simulation -- Running on Fumes - Preventing Out-of-Gas Vulnerabilities...”
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16
Published 2020
Springer International Publishing
Table of Contents: “... of rational modes of use of marginal dug-out wells -- Ноse regulating device with swirling -- Theoretical...”
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17
Published 2013
Springer New York
Table of Contents: “...Introduction to Optical Interconnects in Data Centers -- Optical Interconnects for Scale-Out Data...”
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18
Published 2006
Springer Berlin Heidelberg
Table of Contents: “... Interconnect: the Problem of the In/Out Coupling -- Si Microphotonics for Optical Interconnection -- Silicon...”
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19
by Lee, Jae-Beom, Kalva, Hari
Published 2008
Springer US
Table of Contents: “... Prediction -- H.264 Inter Prediction -- In-Loop and Out-Loop Filters -- Deblocking Process -- VC-1 In-Loop...”
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20
by Wang, Hongzhou, Pham, Hoang
Published 2006
Springer London
Table of Contents: “... Maintenance Policies of k-out-of-n Systems -- Reliability and Optimal Inspection-maintenance Models of Multi...”