MPG.eBooks - Author Search Results

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1

Fan-Out Wafer-Level Packaging

by Lau, John H.
Published 2018

Springer Nature Singapore

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2

Heterogeneous Integrations

by Lau, John H.
Published 2019

Springer Nature Singapore

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3

Semiconductor Advanced Packaging

by Lau, John H.
Published 2021

Springer Nature Singapore

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4

Chiplet Design and Heterogeneous Integration Packaging

by Lau, John H.
Published 2023

Springer Nature Singapore

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5

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

by Lau, John H.
Published 2024

Springer Nature Singapore

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6

Solder Joint Reliability : Theory and Applications

by Lau, John H.
Published 1991

Springer US

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7

Assembly and Reliability of Lead-Free Solder Joints

by Lau, John H., Lee, Ning-Cheng
Published 2020

Springer Nature Singapore