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1
by Lau, John H.
Published 2018
Springer Nature Singapore
Table of Contents: “...Patent Issues of Fan-out Wafer-Level Packaging -- Flip Chip Technology vs. FOWLP -- Fan-In Wafer...”
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2
by Lau, John H.
Published 2024
Springer Nature Singapore
Table of Contents: “...-- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology...”
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3
by Lau, John H.
Published 2021
Springer Nature Singapore
Table of Contents: “...-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC...”
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4
by Lau, John H.
Published 2019
Springer Nature Singapore
Table of Contents: “... Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter...”
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5
by Lau, John H.
Published 2023
Springer Nature Singapore
“... communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding...”