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author_facet:"Lau, John H."
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1
Assembly and Reliability of Lead-Free Solder Joints
by
Lau, John H.
,
Lee, Ning-Cheng
Published 2020
Springer Nature Singapore
Subjects:
“
...
Electronic
Circuits
and
Systems
...
”
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2
Heterogeneous Integrations
by
Lau, John H.
Published 2019
Springer Nature Singapore
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“
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Electronic
Circuits
and
Systems
...
”
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3
Fan-Out Wafer-Level Packaging
by
Lau, John H.
Published 2018
Springer Nature Singapore
Subjects:
“
...
Electronic
Circuits
and
Systems
...
”
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4
Chiplet Design and Heterogeneous Integration Packaging
by
Lau, John H.
Published 2023
Springer Nature Singapore
Subjects:
“
...
Electronic
Circuits
and
Systems
...
”
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5
Solder Joint Reliability : Theory and Applications
by
Lau, John H.
Published 1991
Springer US
Subjects:
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...
Electronic
Circuits
and
Systems
...
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Author: Lau, John H.
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621 - Applied physics
5
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English
5
Collection
Springer eBooks 2005-
4
Springer Book Archives -2004
1
Author
Lau, John H.
Lee, Ning-Cheng
1
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