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author_facet:"Lau, John H."
dewey-ones:"621 - Applied physics"
product_txtF_mv:"Springer eBooks 2005-"
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1
Assembly and Reliability of Lead-Free Solder Joints
by
Lau, John H.
,
Lee, Ning-Cheng
Published 2020
Springer Nature Singapore
Subjects:
“
...Electronics and Microelectronics,
Instrumentation
...
”
Read Now
2
Heterogeneous Integrations
by
Lau, John H.
Published 2019
Springer Nature Singapore
Subjects:
“
...Electronics and Microelectronics,
Instrumentation
...
”
Read Now
3
Semiconductor Advanced Packaging
by
Lau, John H.
Published 2021
Springer Nature Singapore
Subjects:
“
...Electronics and Microelectronics,
Instrumentation
...
”
Read Now
4
Chiplet Design and Heterogeneous Integration Packaging
by
Lau, John H.
Published 2023
Springer Nature Singapore
Subjects:
“
...Electronics and Microelectronics,
Instrumentation
...
”
Read Now
5
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
by
Lau, John H.
Published 2024
Springer Nature Singapore
Subjects:
“
...Electronics and Microelectronics,
Instrumentation
...
”
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Lee, Ning-Cheng
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