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author_facet:"American Chemical Society Division of Polymeric Materials: Science and Engineering"
dewey-ones:"621 - Applied physics"
product_txtF_mv:"ACS Symposium Series"
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1
Polymeric materials for electronics packaging and interconnection
Published 1989
American Chemical Society
Subjects:
“
...
Imides
...
”
Call Number:
TK7870
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2
Microelectronics technology : polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering...
Published 1995
American Chemical Society
Subjects:
“
...
Imides
/ analysis...
”
Call Number:
TK7874
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3
Micro- and nanopatterning polymers
Published 1998
American Chemical Society
Subjects:
“
...
Imides
...
”
Call Number:
TK7871.15.P6
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4
Polymeric materials for microelectronic applications : science and technology
Published 1995
American Chemical Society
Subjects:
“
...
Imides
/ analysis...
”
Call Number:
TK7871.15.P6
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Author: American Chemical Society Division of Polymeric Materials: Science and Engineering
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Classification: 621 - Applied physics
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Collection: ACS Symposium Series
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621 - Applied physics
Language
English
4
Collection
ACS Symposium Series
Author
American Chemical Society Division of Polymeric Materials: Science and Engineering
Ito, Hiroshi
2
Reichmanis, Elsa
2
American Chemical Society Division of Polymer Chemistry
1
American Chemical Society Meeting ( 1988, Los Angeles, California)
1
American Chemical Society Meeting ( 1995, Anaheim, California)
1
more ...
American Chemical Society Meeting ( 1997, Las Vegas, Nevada)
1
Horie, Kazuyuki
1
Iwayanagi, Takao
1
Kōbunshi Gakkai (Japan) Polymers for Microelectronics Division
1
Kōbunshi Gakkai (Japan) Polymers for Microelectronics and Photonics Group
1
Lupinski, John H.
1
MacDonald, Scott A.
1
Moore, Robert S.
1
Nalamasu, Omkaram
1
Ober, Christopher K.
1
Polymers for Microelectronics (1993, Kawasaki, Japan)
1
Tagawa, Seiichi
1
Ueno, Takumi
1
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