MPG.eBooks - Description: Polymeric materials for electronics packaging and interconnection

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Polymeric materials for electronics packaging and interconnection

Bibliographic Details
Corporate Authors:	American Chemical Society Division of Polymeric Materials: Science and Engineering, American Chemical Society Division of Polymer Chemistry, American Chemical Society Meeting ( 1988, Los Angeles, California)
Other Authors:	Lupinski, John H. (Editor), Moore, Robert S. (Editor)
Format:	eBook
Language:	English
Published:	Washington, DC American Chemical Society 1989, 1989
Series:	ACS symposium series
Subjects:	Electronic Apparatus And Appliances / Plastic Embedment / Technological Innovations Spectrometry, Fluorescence Fluorescence Spectroscopy Photoelectron Spectroscopy Polymers / Analysis Bromine Compounds / Analysis Integrated Circuits / Materials Electric Currents / Measurement / Models Coatings Epoxy Compounds Electricity Imides Silicones / Industrial Applications Neuroprostheses / Materials Spectroscopy, Fourier Transform Infrared Insulating Materials Polyimides / Electric Properties Integrated Circuits / Very Large Scale Integration Electrophoresis Interconnects (integrated Circuit Technology) Silicones Semiconductors / Materials Polyimides / Additives / Electric Properties Electronics Interconnects (integrated Circuit Technology) / Materials Surface Properties Paint Thin Films, Multilayered Neural Prostheses Hot Temperature Semiconductors Electronic Apparatus And Appliances / Plastic Embedment Electrical Equipment And Supplies X-ray Photoelectron Spectroscopy Polymers Wire Bonding (electronic Packaging) / Stability Polyimides / Curing / Analysis Electrophoretic Deposition Epoxy Compounds / Transport Properties Wire Bonding (electronic Packaging) / Deterioration Molding Materials / Technological Innovations Technology & Engineering / Textiles & Polymers / Bisacsh Imides / Analysis Butyrates / Chemical Synthesis Butyrates / Synthesis Siloxanes Product Packaging Molding Materials / Effect Of Stress On Microelectronics / Materials Thermosetting Plastics / Formation / Methodology Inventions Bromine Compounds / Stability / Analysis Dielectric Devices / Analysis Manufactured Materials Plastics Dielectric Films Plastic Films / Effect Of Stress On Construction Materials Technology & Engineering / Materials Science / Electronic Materials / Bisacsh Fourier Transform Infrared Spectroscopy Electronic Packaging / Materials Resins, Synthetic Integrated Circuits / Packaging / Materials Siloxanes / Industrial Applications Epoxy Compounds / Molding / Effect Of Heat On
Online Access:	https://pubs.acs.org/doi/book/10.1021/bk-1989-0407
Collection:	ACS Symposium Series - Collection details see MPG.ReNa

Description
Item Description:	"Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988.". - Distributed in print by Oxford University Press
Physical Description:	516 pages illustrations
ISBN:	9780841212633