MEMS Packaging Technologies and 3D Integration
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers...
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Format: | eBook |
Language: | English |
Published: |
MDPI - Multidisciplinary Digital Publishing Institute
2022
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Online Access: | |
Collection: | Directory of Open Access Books - Collection details see MPG.ReNa |
Summary: | This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation. |
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Item Description: | Creative Commons (cc), https://creativecommons.org/licenses/by/4.0/ |
Physical Description: | 1 electronic resource (210 p.) |
ISBN: | 9783036542577 9783036542584 books978-3-0365-4257-7 |