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MEMS Packaging Technologies and 3D Integration

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers...

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Bibliographic Details
Main Author: Seok, Seonho
Format: eBook
Language:English
Published: MDPI - Multidisciplinary Digital Publishing Institute 2022
Subjects:
Surface Roughness
Au-au Bonding
Adhesion
Fuzzy Ahp
Microsystem Integration
Inkjet Printing
Mems Resonator
Multilayer Reactive Bonding
Finite Element
Millimeter-wave
N/a
Mcdm
Fuzzy Vikor
Reliability Life
Thermal Sensors
Finite Element Method (fem)
Integrated Nanostructure-multilayer Reactive System
Fan-out Wafer-level Package
Parylene
Low-temperature Mems Packaging
Room-temperature Bonding
Packaging-on-packaging
Optical And Electromagnetics Simulations
Pd/al Reactive Multilayer System
Temperature Coefficient
Microelectromechanical Systems (mems) Packaging
Simulation
Thermal Stress
Spontaneous Self-ignition
Au Film Thickness
Stress Intensity Factor (sif)
Finite Difference Time Domain
Thin Film Metal
Chronic Implantation
Capacitive Micromachined Ultrasound Transducers (cmut)
Reliability
Ni/al Reactive Multilayer System
Biocompatible Packaging
Wafer Sealing
Ultrasonic Bonding
Tmos Sensor
Redistribution Layers
Research & Information: General / Bicssc
Neural Probe
Biology, Life Sciences / Bicssc
Self-propagating Exothermic Reaction
Fan-out Wafer-level Packaging (fowlp)
Equivalent Circuit Model
Neural Interface
Glass Substrate
Mems And Ic Integration
Finite Element Analysis
Deflection Angle
Metal Direct Bonding
Redundant Tsv
Implantable
Surface Activated Bonding
Fem
Heterogeneous Integration
Polymer Packaging
Wafer Bonding
Technology Evaluation
S-parameters Extraction
Scotch Tape Test
Microbump
Crack Propagation
Online Access:
Collection: Directory of Open Access Books - Collection details see MPG.ReNa
Description
Summary:This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
Item Description:Creative Commons (cc), https://creativecommons.org/licenses/by/4.0/
Physical Description:1 electronic resource (210 p.)
ISBN:9783036542577
9783036542584
books978-3-0365-4257-7

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