Nanoparticle Engineering for Chemical-Mechanical Planarization Fabrication of Next-Generation Nanodevices
Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarizat...
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| Format: | eBook |
| Language: | English |
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Taylor & Francis
2009
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| Collection: | Directory of Open Access Books - Collection details see MPG.ReNa |
| Summary: | Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance. |
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| Item Description: | Creative Commons (cc), https://creativecommons.org/licenses/by-nc-nd/4.0/legalcode |
| ISBN: | 9780367446062 9780429291890 9781420059113 9781420059137 9781000023220 |