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210512 ||| eng |
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|a books978-3-03943-033-8
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|a 9783039430321
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|a 9783039430338
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|a Fino, Paolo
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|a Materials Development by Additive Manufacturing Techniques
|h Elektronische Ressource
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|a Basel, Switzerland
|b MDPI - Multidisciplinary Digital Publishing Institute
|c 2021
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300 |
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|a 1 electronic resource (118 p.)
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|a high performance ceramics
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|a 3D printing
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|a Ni-Cu alloy
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|a amorphous poly(lactide acid)
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|a as-built
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|a microhardness
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|a photopolymerisation
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|a History of engineering and technology / bicssc
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|a design of experiments
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|a tensile test
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|a additive manufacturing
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|a materials development
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|a directed energy deposition
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|a silicon nitride
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|a poly(styrene-co-methyl methacrylate)
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|a polymers
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|a AISI 316L
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|a metals
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|a polyetherimide
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|a LPBF
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|a polymer blends
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|a fused-deposition modeling
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|a filament extrusion
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|a as-cast
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|a thermal behavior
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|a fused filament modelling
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|a mechanical properties
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|a ceramics
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|a microstructure
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|a lithography-based ceramic manufacturing
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|a Aversa, Alberta
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|a Fino, Paolo
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|a Aversa, Alberta
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|a eng
|2 ISO 639-2
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|b DOAB
|a Directory of Open Access Books
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|a Creative Commons (cc), https://creativecommons.org/licenses/by/4.0/
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|a 10.3390/books978-3-03943-033-8
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|u https://directory.doabooks.org/handle/20.500.12854/68502
|z DOAB: description of the publication
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|u https://www.mdpi.com/books/pdfview/book/3522
|7 0
|x Verlag
|3 Volltext
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|a 900
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|a 333
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|a 600
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|a 620
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|a Additive manufacturing (AM) processes are gaining more and more attention from many industrial fields, mainly because they are revolutionizing the components' designs and production lines. The complete industrialization of these processes has to be supported by the full understanding of correlation between AM building conditions and the final materials' properties. Another critical aspect is that nowadays only a reduced number of materials processable by AM are available on the market. It is, therefore, fundamental to widen the materials' portfolio, and to study and develop new materials that can take advantage of these unique building processes.
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