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210512 ||| eng |
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|a 9783039216345
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|a books978-3-03921-635-2
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|a 9783039216352
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|a Koley, Goutam
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|a MEMS/NEMS Sensors: Fabrication and Application
|h Elektronische Ressource
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260 |
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|b MDPI - Multidisciplinary Digital Publishing Institute
|c 2019
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300 |
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|a 1 electronic resource (242 p.)
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|a acceleration switch
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|a analytical model
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|a frequency split
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|a low noise
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|a MEMS
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|a n/a
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|a microwave measurement
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|a microfluidic
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|a optomechanical sensor
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|a rapid fabrication
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|a wet etching
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|a floating slug
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|a inertial switch
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|a squeeze-film damping
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|a deflection position detector
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|a History of engineering and technology / bicssc
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|a thermoelectric power sensor
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|a oil detection
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|a scanning grating mirror
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|a tetramethylammonium hydroxide (TMAH)
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|a gas sensor
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|a suspended micro hotplate
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|a wideband
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|a frequency tuning
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|a microgyroscope
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|a MEMS (micro-electro-mechanical system)
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|a quadrature modulation signal
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|a micro-NIR spectrometer
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|a photonic crystal cavity
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|a microactuator
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|a spring design
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|a optical sensor
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|a frequency mismatch
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|a microdroplet
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|a level-set method
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|a electrostatic force feedback
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|a accelerometer
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|a back cavity
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|a GaN diaphragm
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|a tracking performance
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|a GaAs MMIC
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|a Accelerometer readout
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|a temperature uniformity
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|a silicon
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|a threshold accuracy
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|a photonic crystal nanobeam cavity
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|a power consumption
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|a temperature sensor
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|a micropellistor
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|a vibrating ring gyroscope
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|a nanoparticle sensor
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|a dual-mass MEMS gyroscope
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|a low zero-g offset
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|a glass welding
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|a backstepping approach
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|a tunnel magnetoresistive effect
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|a single crystal silicon
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|a pulse inertia force
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|a resonant frequency
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|a single-layer SiO2
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|a magnetic
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|a resistance parameter
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|a adaptive control
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|a femtosecond laser
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|a bonding strength
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|a micro fluidic
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|a methane
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|a accelerometer design
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|a refractive index sensor
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|a anisotropy
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|a infrared image
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|a 3D simulation
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|a AlGaN/GaN circular HFETs
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|a high temperature pressure sensors
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1 |
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|a Jahangir, Ifat
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041 |
0 |
7 |
|a eng
|2 ISO 639-2
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989 |
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|b DOAB
|a Directory of Open Access Books
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500 |
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|a Creative Commons (cc), https://creativecommons.org/licenses/by-nc-nd/4.0/
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028 |
5 |
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|a 10.3390/books978-3-03921-635-2
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856 |
4 |
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|u https://www.mdpi.com/books/pdfview/book/1827
|7 0
|x Verlag
|3 Volltext
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856 |
4 |
2 |
|u https://directory.doabooks.org/handle/20.500.12854/53149
|z DOAB: description of the publication
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|a 900
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|a 700
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|a 600
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|a 620
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|a Due to the ever-expanding applications of micro/nano-electromechanical systems (NEMS/MEMS) as sensors and actuators, interest in their development has rapidly expanded over the past decade. Encompassing various excitation and readout schemes, the MEMS/NEMS devices transduce physical parameter changes, such as temperature, mass or stress, caused by changes in desired measurands, to electrical signals that can be further processed. Some common examples of NEMS/MEMS sensors include pressure sensors, accelerometers, magnetic field sensors, microphones, radiation sensors, and particulate matter sensors. Despite a long history of development, fabrication of novel MEMS/NEMS devices still poses unique challenges due to their requirement for a suspended geometry; and many new fabrication techniques have been proposed to overcome these challenges. However, further development of these techniques is still necessary, as newer materials such as compound semiconductors, and 2-dimensional materials are finding their way in various MEMS/NEMS applications, with more complex structures and potentially smaller dimensions.
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