Semiconductor Packaging Materials Interaction and Reliability

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Bibliographic Details
Main Author: Chen, Andrea
Format: eBook
Language:English
Published: Hoboken CRC Press 2011
Subjects:
Online Access:
Collection: O'Reilly - Collection details see MPG.ReNa
Description
Summary:In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how
Physical Description:208 pages
ISBN:6613274607
9781283274609
113807540X
9781000218619
1439862079
9781439862070
0429063350
1439862052
9786613274601
9780429063350
1283274604
9781138075405
9781439862056