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Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next g...

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Bibliographic Details
Other Authors: Kondo, Kazuo (Editor), Kada, Morihiro (Editor), Takahashi, Kenji (Editor)
Format: eBook
Language:English
Published: Cham Springer International Publishing 2015, 2015
Edition:1st ed. 2015
Subjects:
Semiconductors
Biomedical Engineering
Biomedical Engineering And Bioengineering
Electrochemistry
Electrical Engineering
Mechanical Engineering
Online Access:
Collection: Springer eBooks 2005- - Collection details see MPG.ReNa
Table of Contents:
  • Research and Development History of Three Dimensional (3D) Integration Technology
  • Recent Research and Development Activities of Three Dimensional (3D) Integration Technology
  • TSV Processes
  • Wafer and Die Bonding Processes
  • Metrology and Inspection
  • TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability
  • Trends in 3D Integrated Circuit (3D-IC) Testing Technology
  • Dream Chip Project at ASET.

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