Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

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Bibliographic Details
Main Authors: Liu, Xingsheng, Zhao, Wei (Author), Xiong, Lingling (Author), Liu, Hui (Author)
Format: eBook
Language:English
Published: New York, NY Springer New York 2015, 2015
Edition:1st ed. 2015
Series:Micro- and Opto-Electronic Materials, Structures, and Systems
Subjects:
Online Access:
Collection: Springer eBooks 2005- - Collection details see MPG.ReNa
Description
Summary:This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed
Physical Description:XV, 402 p. 497 illus., 386 illus. in color online resource
ISBN:9781461492634