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Advances in Rapid Thermal and Integrated Processing

Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are co...

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Bibliographic Details
Other Authors: Roozeboom, F. (Editor)
Format: eBook
Language:English
Published: Dordrecht Springer Netherlands 1996, 1996
Edition:1st ed. 1996
Series:NATO Science Series E:, Applied Sciences
Subjects:
Spectrum Analysis
Condensed Matter Physics
Spectroscopy
Optical Materials
Materials / Analysis
Characterization And Analytical Technique
Condensed Matter
Online Access:
Collection: Springer Book Archives -2004 - Collection details see MPG.ReNa
Table of Contents:
  • 1. Introduction: history and perspectives of Rapid Thermal Processing
  • 2. The thermal radiative properties of semiconductors
  • 3. Wafer temperature measurement in RTP
  • 4. Wafer emissivity in RTP
  • 5. Temperature and process control in Rapid Thermal Processing
  • 6. Single-wafer process integration and process control techniques
  • 7. Rapid Thermal O2-oxidation and N2O-oxynitridation
  • 8. Integrated pre-gate dielectric cleaning and surface preparation
  • 9. Dielectric photoformation on Si and SiGe
  • 10. Modeling strategies for Rapid Thermal Processing: finite element and Monte Carlo methods
  • 11. Modeling approaches for Rapid Thermal Chemical Vapor Deposition: combining transport phenomena with chemical kinetics
  • 12. Silicidation and metallization issues using Rapid Thermal Processing
  • 13. Rapid Thermal Multiprocessing for a programmable factory for manufacturing of ICs
  • 14. RTCVD integrated processing for photovoltaic application
  • 15. Equipment design, cluster tools and scale-up issues
  • 16. Rapid Thermal Chemical Vapor Deposition of epitaxial Si and SiGe
  • 17. The evolving role of Rapid Thermal Processing for deep submicron devices
  • 18. Rapid Thermal Processing of contacts and buffer layers for compound semiconductor device technology
  • 19. Rapid Thermal Processing of magnetic thin films for data storage devices
  • Appendix List of ASI participants

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