Cooling of Electronic Systems
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts...
| Other Authors: | , , |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
Dordrecht
Springer Netherlands
1994, 1994
|
| Edition: | 1st ed. 1994 |
| Series: | NATO Science Series E:, Applied Sciences
|
| Subjects: | |
| Online Access: | |
| Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Table of Contents:
- to ASI on Cooling of Electronic Systems
- Trends in the Packaging of Computer Systems
- Beyond Thermal Limits in Computer Systems Cooling
- Cooling Technology for High Performance Computers: Design Applications
- Cooling Technology for High Performance Computers: IBM Sponsored University Research
- Natural Convection Cooling of an Array of Heated Plates Simulating Printed Circuit Boards
- Convection in Arrays of Electronic Packages Containing Longitudinal Fin Heat Sinks
- Experiments on Natural Convective Air Cooling of a PCBs Array in a Closed Casing with Inclination
- Cooling of Multiple Heat Sources Attached to Two Dimensional Rectangular Fins
- Natural Convection Heat Transfer from Horizontal Rectangular Fin Arrays
- Cooling of a Microelectronic Sensor by Turbulent Forced Convection
- Computation of Steady Laminar Natural Convective Heat Transfer from Localized Heat
- Unsteady Forced Convection in a Duct with and without Array of Block-Like Electronic Components
- Analysis of Extended Surface Arrays for Air-Cooled Electronic Equipment
- The Choking of Finned Arrays
- Error Analysis and Improved Formulations for Extended Surfaces
- Determination of the Weighted-Average Case Temperature for a Single Chip Package
- Network Modelling of Two-Phase Flow in Porous Structures: An Alternative for the Study of Chip Cooling Enhancement
- Accurate Temperature Prediction in Consumer Electronics: A Must but still a Myth
- Pragmatic Methods for Determining the Parameters Required for the Thermal Analysis of Electronic Systems
- Effective Heat Transfer Coefficients and Temperature Modelling in Electronic Systems
- Information Processing and Heat Transfer Engineering: Some Generic Views on Future Research Needs
- Research Needs in Thermal Management of Electronic Systems
- Optimal Geometryof Convection Cooled Electronic Packages
- A Thermal Design Approach for Electronic Equipment by use of a Personal Computer and Flow Visualization
- Experimental Visualization of Temperature Fields and Measurement of Heat Transfer Enhancement in Electronic System Models
- Cooling of Electronic Systems by Impinging Air Jets
- Numerical and Experimental Studies for the Conjugate Direct Cooling of a Micro Heat Generating Element
- The Cooling of Electronic Components with Flat Plate Heat Sinks
- Fundamentals of Nucleate Pool Boiling of Highly-Wetting Dielectric Liquids.
- Single-Phase Liquid Jet Impingement Cooling of High-Performance Chips
- Application of Channel Flows to Single-Phase Liquid Cooling of Chips and Multi-Chip Modules
- Immersion Cooling of Digital Computers
- Boiling Coupled with Air Cooling
- Thermal Control for Cryogenically Cooled Computer Systems
- Thermal Contact Conductance-Theory and Applications