MCM C/Mixed Technologies and Thick Film Sensors

Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thic...

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Corporate Author: SpringerLink (Online service)
Other Authors: Jones, W.K. (Editor), Kurzweil, Karel (Editor), Harsányi, Gábor (Editor), Mergui, Sylvia (Editor)
Format: eBook
Language:English
Published: Dordrecht Springer Netherlands 1995, 1995
Edition:1st ed. 1995
Series:Nato Science Partnership Subseries: 3, High Technology
Subjects:
Online Access:
Collection: Springer Book Archives -2004 - Collection details see MPG.ReNa
Summary:Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area
Physical Description:X, 318 p online resource
ISBN:9789401100793