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Reliability of Electronic Components A Practical Guide to Electronic Systems Manufacturing

The objective of this book is to better understand why components fail, addressing the needs of engineers who will apply reliability principles in design, manufacture, testing, and field service. It so contributes to new approaches and the development of electronic and telecommunications component r...

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Bibliographic Details
Main Authors: Bajenescu, Titu I., Bazu, Marius I. (Author)
Format: eBook
Language:English
Published: Berlin, Heidelberg Springer Berlin Heidelberg 1999, 1999
Edition:1st ed. 1999
Subjects:
Security Science And Technology
Electronics And Microelectronics, Instrumentation
Security Systems
Electronics
Online Access:
Collection: Springer Book Archives -2004 - Collection details see MPG.ReNa
Table of Contents:
  • 15.4 Detailed failure modes for some components
  • 15.5 Storage reliability data [15.3]
  • 15.6 Failure criteria. Some examples
  • 15.7 Typical costs for the screening of plastic encapsulated ICs
  • 15.8 Results of 1000 h HTB life tests for CMOS microprocessors
  • 15.9 Results of 1000 h HTB life tests for linear circuits
  • 15.10 Average values of the failure rates for some IC families
  • 15.11 Activation energy values for various technologies
  • 15.12 Failures at burn-in
  • References
  • General Bibliography
  • Reliability Glossary
  • List of Abbreviations
  • Polyglot Dictionary of Reliability Terms
  • 12.2 Package problems
  • 12.3 Some reliabilistic aspects of the plastic encapsulation
  • 12.4 Reliability tests
  • 12.5 Reliability predictions
  • 12.6 Failure analysis
  • 12.7 Technological improvements
  • 12.8 Can we use plastic encapsulated microcircuits (PEM) in high reliability applications?
  • References
  • 13 Test and Testability of Logic Ics
  • 13.1 Introduction
  • 13.2 Test and test systems
  • 13.3 Input control tests of electronic components
  • 13.4 LIC selection and connected problems
  • 13.5 Testability of LICs
  • 13.6 On the testability of electronic and telecommunications systems
  • References
  • 14 Failure Analysis
  • 14.1 Introduction [14.1]...[14.25]
  • 14.2 The purpose of failure analysis
  • 14.3 Methods of analysis
  • 14.4 Failure causes.-14.5 Some examples
  • References
  • 15 Appendix
  • 15.1 Software-package RAMTOOL++ [15.1]
  • 15.2 Failure rates for components used in telecommunications
  • 15.3 Failure types for electronic components [15.2]
  • 8.7 Influence of radiation
  • 8.8 Prospect outlook of the hybrid technology
  • 8.9 Die attach and bonding techniques
  • 8.10 Failure mechanisms
  • References
  • 9 Reliability of Memories
  • 9.1 Introduction
  • 9.2 Process-related reliability aspects
  • 9.3 Possible memories classifications
  • 9.4 Silicon On Insulator (SOI) technologies
  • 9.5 Failure frequency of small geometry memories
  • 9.6 Causes of hardware failures
  • 9.7 Characterisation testing
  • 9.8 Design trends in microprocessor domain
  • 9.9 Failure mechanisms of microprocessors
  • References
  • 10 Reliability of Optoelectronics
  • 10.1 Introduction
  • 10.2 LED reliability
  • 10.3 Optocouplers
  • 10.4 Liquid crystal displays
  • References
  • 11 Noise and Reliability
  • 11.2 Excess noise and reliability
  • 11.3 Popcorn noise
  • 11.4 Flicker noise
  • 11.5 Noise figure
  • 11.6 Improvements in signal quality of digital networks
  • References
  • 12 Plastic Package and Reliability
  • 12.1 Historical development
  • 5.2 Technologies and power limitations
  • 5.3 Electrical characteristics
  • 5.4 Reliability characteristics
  • 5.5 Thermal fatigue
  • 5.6 Causes of failures
  • 5.7 The package problem
  • 5.8 Accelerated tests
  • 5.9 How to improve the reliability
  • 5.10 Some recommendations
  • References
  • 6 Reliability of Thyristors
  • 6.1 Introduction
  • 6.2 Design and reliability
  • 6.3 Derating
  • 6.4 Reliability screens by General Electric
  • 6.5 New technology in preparation: SITH
  • References
  • 7 Reliability of Integrated Circuits
  • 7.1 Introduction
  • 7.2 Reliability evaluation
  • 7.3 Failure analysis
  • 7.4 Screening and burn-in
  • 7.5 Comparison between the IC families TTL Standard and TTL-LS
  • 7.6 Application Specific Integrated Circuits (ASIC)
  • References
  • 8 Reliability of Hybrids
  • 8.1 Introduction
  • 8.2 Thin-film hybrid circuits
  • 8.3 Thick-film hybrids
  • 8.4Thick-film versus thin-film hybrids
  • 8.5 Reliability of hybrid ICs
  • 8.6 Causes of failures
  • 1 Introduction
  • 1.1 Definition of reliability
  • 1.2 Historical development perspective
  • 1.3 Quality and reliability
  • 1.4 Economics and optimisation
  • 1.5 Probability; basic laws
  • 1.6 Specific terms
  • 1.7 Failures types
  • 1.8 Reliability estimates
  • 1.9 “Bath—tub” failure curve
  • 1.10 Reliability of electronic systems
  • 1.11 Some examples
  • References
  • 2 State of the Art in Reliability
  • 2.1 Cultural features
  • 2.2 Reliability building
  • 2.3 Reliability evaluation
  • 2.4 Standardisation
  • References
  • 3 Reliability of Passive Electronic Parts
  • 3.1 How parts fail
  • 3.2 Resistors
  • 3.3 Reliability of capacitors
  • 3.4 Zinc oxide (ZnO) varistors [3.39]...[3.45]
  • 3.5 Connectors
  • References
  • 4 Reliability of Diodes
  • 4.1 Introduction
  • 4.2 Semiconductor diodes
  • 4.3 Z diodes
  • 4.4 Trans-Zorb diodes
  • 4.5 Impatt (IMPact Avalanche and Transit-Time) diodes
  • References
  • 5 Reliability of Silicon Transistors
  • 5.1 Introduction

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