Low Dielectric Constant Materials for IC Applications
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applicat...
| Other Authors: | , , |
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| Format: | eBook |
| Language: | English |
| Published: |
Berlin, Heidelberg
Springer Berlin Heidelberg
2003, 2003
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| Edition: | 1st ed. 2003 |
| Series: | Springer Series in Advanced Microelectronics
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| Subjects: | |
| Online Access: | |
| Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Table of Contents:
- 3.4 Films with Ordered Porous Structure
- 3.5 Limits of SANS Characterization Methods
- 3.6 Future Developments
- 3.7 Conclusion
- References
- 4 Vapor Deposition of Low-? Polymeric Dielectrics
- 4.1 Introduction
- 4.2 Vapor-Phase Deposition and Polymerization on Substrates
- 4.3 Parylenes
- 4.4 Polynaphthalene and Its Derivatives
- 4.5 Teflon and Its Derivatives
- 4.6 Vapor-Deposited Polyimides
- 4.7 Prospects for Vapor-Depositable Low-? Polymers
- References
- 5 Plasma-Enhanced Chemical Vapor Deposition of FSG and a-C:F Low-? Materials
- 5.1 Introduction
- 5.2 FSG Films
- 5.3 a-C:F Films
- References
- 6 Porous Organosilicates for On-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity
- 6.1 Introduction
- 6.2 Porous Silica
- 6.3 Organosilicates
- 6.4 Porogens
- 6.5 Porous OrganosilicateMatrix Resins
- 6.6 Formation of Nanohybrids
- 6.7 Porous Organosilicates
- 6.8 Characterization of Porous Organosilicates
- 1 Overview on Low Dielectric Constant Materials for IC Applications
- 1.1 Introduction
- 1.2 Dielectric Constant and Bonding Characteristics
- 1.3 Material Properties and Integration Requirements
- 1.4 Characterization of Low-? Dielectrics
- 1.5 Porous Low-? Materials
- 1.6 Conclusion
- References
- 2 Materials Issues and Characterization of Low-? Dielectric Materials
- 2.1 Introduction
- 2.2 Thin-Film Material Characterization
- 2.3 General Structure-Property Relationships
- 2.4 Fluorinated Polyimide: Effect of Chemical-Structure Modifications on Film Properties
- 2.5 Crosslinked and Thermosetting Materials
- 2.6 Parylene Polymers: Effect of Thermal History on Film Properties
- 2.7 Future Challenges
- References
- 3 Structure and Property Characterization of Low-? Dielectric Porous Thin Films Determined by X-Ray Reflectivity and Small-Angle Neutron Scattering
- 3.1 Introduction
- 3.2 Two-Phase Methodology
- 3.3 Three-Phase Methodology
- 10.2 SiLK Semiconductor Dielectric
- 10.3 Subtractive Technologies
- 10.4 Damascene Technologies
- 10.5 Cost-of-Ownership
- 10.6 Conclusion
- References
- 6.9 Conclusion
- References
- 7 Metal/Polymer Interfacial Interactions
- 7.1 Introduction
- 7.2 Experimental Methods
- 7.3 Metallization of Fluoropolymers
- 7.4 Polymers on Metals: Adhesion to Cu
- 7.5 Conclusion
- References
- 8 Diffusion of Metals in Polymers and During Metal/Polymer Interface Formation
- 8.1 Introduction
- 8.2 Thermodynamic Considerations
- 8.3 Effect of Metal-Polymer Interaction on the Mobility of Metal Atoms
- 8.4 Surface Diffusion, Nucleation, and Growth of Metal Films
- 8.5 Diffusion and Aggregation
- 8.6 Atomic Diffusion
- 8.7 Conclusion
- References
- 9 Plasma Etching of Low Dielectric Constant Materials
- 9.1 Introduction
- 9.2 Technological Requirements and Patterning Approaches
- 9.3 Fluorocarbon-Based Etching Processes
- 9.4 Directional Etching of Organic Low-? Materials
- 9.5 Postetch Mask-Stripping and Via-Cleaning Processes
- 9.6 Conclusion
- References
- 10 Integration of SiLK Semiconductor Dielectric
- 10.1 Introduction