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140122 ||| eng |
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|a 9783642459368
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100 |
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|a Knoll, Max
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245 |
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|a Materials and Processes of Electron Devices
|h Elektronische Ressource
|b Werkstoffe und Verfahren zur Herstellung von Entladungsgeräten / Matériaux et procédés pour la construction d’appareils de décharges électriques / Materiales y procesos de fabricación para elementos electrónicos
|c by Max Knoll
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250 |
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|a 1st ed. 1959
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260 |
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|a Berlin, Heidelberg
|b Springer Berlin Heidelberg
|c 1959, 1959
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300 |
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|a XVI, 484 p
|b online resource
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|a 6 Glasses. Quartz. Ceramics, etc. -- 6.1 Manufacture, Composition, and General Properties of Glass -- 6.2 Special Physical and Chemical Properties of Glass -- Mechanical Properties. -- Coefficient of Thermal Expansion. -- Thermal Conductivity. -- Electrical Conductivity and Electrolysis. -- Dielectric Losses. -- Dielectric Constant. -- Electrical Breakdown. -- Radiation Transmission. -- Gas Tightness. -- Chemical Resistivity. -- Choice of Glasses According to Application. -- 6.3 Quartz Glass and Quartzware -- Extraction. -- Physical andChemical Properties. -- Technical Applications. -- 6.4 Ceramic Materials -- Hard Porcelain. -- Magnesium Silicate. -- Pure Metallic Oxides. -- 6.5 Mica -- 6.6 Asbestos -- 6.7 Silicon Carbide -- 6.8 References on Manufacture, Composition, and General Properties of Glass (including handbooks) -- 6.9 References on Physical and Chemical Properties of Glass -- 6.10 References on Quartz Glass and Quartzware -- 6.11 References on Ceramic Materials --
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|a Shaping of Crystals by Cold Working. -- Recrystallization. -- Creep Limit and Form Retention. -- Impurities. -- Cast Metal Alloys. -- Sintered Metals and Alloys. -- Structure of Glasses; Phase and Viscosity Diagrams. -- 2 Testing Methods for Vacuum Tube Materials -- 2.1 Spectral Analysis -- X-Ray Spectrography. -- Light Spectrography. -- 2.2 X-Ray Radiography -- 2.3 Inspection of Strains in Glass with the Polariscope -- Polaroid Polarizer or Analyzer. -- Sensitive Tint Plate for Detecting Very Slight Strains. -- Circular Polariscope. -- Babinet Compensator. -- Possible Errors. -- Typical Causes for Strain. -- 2.4 Thickness Measurement of Thin Films -- Interference Method. -- X-Ray Absorption Method, -- 2.5 Measurement of Expansion (dilatometer) -- 2.6 Pyrometers -- 2.7 Black-Body Radiation -- 2.8 Testing Instruments for LuminescentMaterials -- 2.9 Leak Detectors -- Rate of Rise Method. -- Spark Coil Search Method. -- Gas Discharge Color Method. -- Thermal Conductivity Method. --
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|a Oredressing and Extraction. -- Working and Physical Properties. -- Chemical Properties. -- Technical Applications. -- 4.5 Aluminum -- Physical Constants of Aluminum. -- Oredressing and Extraction. -- Working and Physical Properties. -- Chemical Properties. -- 4.5 a Indium -- 4.6 Silver -- Physical Constants of Silver. -- Extraction and Properties. -- Applications. -- 4.7 Beryllium -- Physical Constants of Beryllium. -- Extraction and Properties. -- Chemical Properties. -- Technical Applications. -- 4.8 Mercury -- Extraction. -- Purification. -- Physical Properties. -- Chemical Properties. -- Precautions During Working. -- TechnicalApplications. -- 4.9 Alkaline Metals and Alkaline-Earth Metals -- General Remarks. -- Potassium and Sodium. -- Barium and Strontium. -- Calcium. -- Cesium. -- Rubidium. -- Lithium. -- Magnesium. -- 4.10 Antimony -- 4.11 References on Base Metals -- General. -- Nickel. -- Iron. -- Copper. -- Aluminum. -- Indium. -- Silver. -- Beryllium. -- Mercury. --
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|a 9.2 Outgassing of Metals -- Causes of Gas Content. -- Quantity and Type of Gas. -- Removal of Gases. -- Outgassing of Metals by Melting. -- General
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|a Ionization Method. -- Radium Ionization Gauge. -- Hot Filament Ionization Gauge. -- Cold Cathode Penning Ionization Gauge. -- Hydrogen Pd Valve Method. -- Contamination Method. -- Mass Spectrometer Method. -- Differential Condensation (or Absorption) Method. -- Halogen Leak Detectors. -- Knudsen Gauge. -- 2.10 References on Testing Methods for Vacuum Tube Materials -- General. -- Special Analysis. -- X-Ray Radiography. -- Inspection of Strains in Glass with the Polariscope. -- Thickness Measurements of Thin Films. -- Measurement of Expansion. -- Pyrometers. -- Testing Instruments for Luminous Materials. -- Leak Detectors. -- 3 High Melting Metals and Alloys in Tube Design -- 3.1 Tungsten -- General Physical Constants of Tungsten. -- Methods of Oredressing. -- Extraction of Tungsten from Tungstic Acid. -- Manufacture of Raw Tungsten. -- Influence of Admixtures on the Metallographic Properties. -- Hot Tensile Strength and Ultimate Elongation. --
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|a 1 General Structure and Properties of Materials (Including Metallographic Methods) -- 1.1 Crystallization -- 1.2 Shaping of Crystals by Cold Working (cleavage and slip planes, work hardening ductility, malleability, brittleness) -- 1.3 Recrystallization (growth of new crystals during annealing) -- 1.4 Creep Limit and Form Retention -- 1.5 Impurities -- 1.6 Cast Metal Alloys -- Components Miscible in Liquid and Solid States. -- Components Miscible in Liquid State Only (“mixed crystals”). (Eutectic alloys, type II). -- Components Miscible in Liquid State and Partially or Completely Miscible in Solid State. (Type II alloys.) -- Components Partially Miscible in Liquid State, not Miscible in Solid State. (Type IV alloys.) -- Compound-Forming Alloys. (Type V alloys.) -- 1.7 Sintered Metals and Alloys (powder metallurgy) -- 1.8 Structure of Glasses; Phase and Viscosity Diagrams -- 1.9 References on General Structure and Properties of Materials -- General. -- Crystallization. --
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|a 3.9 Titanium -- 3.10 Rhenium -- Physical Constants of Rhenium. -- Extraction and Working. -- 3.11 References on High Melting Metals -- Condensed Papers and Books on Tungsten. -- Physical and Chemical Properties of Tungsten. -- Manufacturing of Tungsten. -- Filaments for Incandescent Lamps and Cathodes. -- Other Applications. -- Molybdenum. -- Tungsten-Molybdenum Alloys. -- Tantalum and Columbium. -- Platinum and its Alloys. -- Palladium. -- Zirconium. -- Titanium. -- Thorium. -- Rhenium. -- 4 Base Metals in Tube Design -- 4.1 General Remarks -- 4.2 Nickel -- Physical Constants of Pure Nickel. -- Oredressing and Extraction. -- Raw Working of Nickel. -- Physical Properties and Working. -- Chemical Properties. -- Technical Applications. -- 4.3 Iron -- Physical Constants of Pure Iron. -- Oredressing and Extraction. -- Raw Working. -- Physical Properties and Working. -- Chemical Properties. -- Technical Applications. -- 4.4 Copper -- Physical Constants of Pure Copper. --
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|a Alkali Metals and Alkali Earths Including Alloys. -- Antimony. -- 5 Alloys of Base Metals -- 5.1 Introduction -- 5.2 Fe-Ni alloys -- Fe-Ni Alloys for Glass Sealings. -- Invar. -- Frigidal. -- Kovar. -- Vacuum Melted Ni-Fe (and Cr-Fe) Alloys. -- 5.3 Fe-Cr Alloys -- Chrome Iron for Glass Sealings. -- Stainless Steel. -- 5.4 Nickel Alloys -- Nickel-Chrome. -- Nickel-Manganese. -- Nickel-Beryllium. -- Nickel-Cobalt. -- Nickel-Barium. -- Konel Metal. -- Monel Metal. -- 5.5 Copper Alloys -- Copper-Beryllium. -- Copper-Nickel. -- Copper-Zinc. -- Copper-Tin. -- 5.6 Alloys of Base Metals with High Melting Metals -- Iron-Molybdenum-Cobalt. -- Nickel-Iron-Chromium-Molybdenum. -- Nickel-Iron-Molybdenum. -- Iron-Nickel. -- Nickel-Iron-Tungsten. -- Tungsten-Nickel-Cobalt. -- Tungsten-Copper. -- 5.7 References on Alloys of Ease Metals -- General. -- Iron-Nickel Alloys. -- Iron-Chromium Alloys. -- Nickel Alloys. -- Copper Alloys. -- Alloys of Base Metals with High Melting Metals. --
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|a 6.12 References on Mica -- 6.13 References on Asbestos -- 6.14 References on Silicon Carbide -- 7 Semiconductors and Organic Materials -- 7.1 Selenium -- Production of Barrier Junctions and Rectifying Contacts. -- 7.2 Germanium -- Preparation and Doping. -- Production of Ohmic (Nonrectifying) Contacts. -- Encapsulation. -- 7.3. Silicon -- Production of Ohmic Contacts. -- 7.4 Intermetallic Compounds -- 7.5 Carbon and Electrographite -- Manufacture. -- Chemical Properties. -- Technical Applications. -- 7.6 Rubber -- 7.7 Stopcock Grease, Oil, and Cements -- Packing Grease. -- Vacuum Oils. -- Sealing Cements. -- 7.8 Plastics for Electron Devices -- 7.9 Tube Basing Cements -- 7.10 References on Semiconductors in General -- 7.11 References on Selenium and Other Semiconductors -- 7.12 References on Germanium -- 7.13 References on Silicon -- 7.14 References on Electrographite -- 7.15 References on Rubber -- 7.16 References on Vacuum Greases, Oils, and Cements --
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|a 7.17 References on Base Cements for Vacuum Tubes -- 8 Gases and Vapors and Their Use in Vacuum Tubes -- 8.1 General Properties and Selection -- Filling Pressure and Working Pressure. -- Current Conduction. -- Breakdown Voltage. -- Back Ignition. -- Cathode Drop and Cathode Sputtering. -- Voltage Gradient of the Positive Column. -- Light Production. -- Other Applications. -- 8.2 Noble Gases -- Extraction. -- Purification. -- Born Cell..-Gehlhoff-Schröter Cell. -- Purity Test. -- Filling Methods. -- 8.3 Non-Noble Gases -- Hydrogen. -- Oxygen. -- Nitrogen. -- Carbon Dioxide. -- Physical and Chemical Properties. -- Filling Methods. -- 8.4 Vapors -- Extraction. -- Physical and Chemical Properties. -- Filling Methods. -- Regulation of Vapor Pressure. -- 8.5 References on Gases and Vapors -- General Properties and Comparative Properties. -- Noble Gases. -- Non-Noble Gases. -- Vapors. -- 9 Working and Pre-Outgassing of Metallic Vacuum Tube Parts -- 9.1 Shaping and Assembling --
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|a Modulus of Elasticity and Modulus of Torsion. -- Thermal Data. -- Chemical Properties. -- Typical Vacuum Tube Elements Made from Tungsten. -- 3.2 Molybdenum -- Physical Constants. -- Methods of Oredressing. -- Metal Extraction. -- Manufacture of Raw Molybdenum. -- Physical Properties and Workability. -- Chemical Properties. -- Technical Applications. -- 3.3 Tungsten-Molybdenum Alloys -- 3.4 Tantalum -- Physical Constants. -- Oredressing and Metal Extraction. -- Physical Properties. -- Chemical Properties. -- Gas Evolution Characteristic. -- Gas Absorption Characteristic. -- Heat Radiation Characteristic and Output. -- 3.5 Columbium (Niobium) -- 3.6 Metals of the Platinum Group and their Alloys -- Physical Constants of Pure Platinum. -- Oredressing and Manufacture. -- Physical Properties. -- Chemical Properties. -- Technical Applications. -- 3.7 Palladium -- 3.8 Zirconium -- Physical Constants. -- Extraction and Physical Properties. -- Chemical Properties. -- Technical Applications. --
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653 |
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|a Engineering
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653 |
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|a Technology and Engineering
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|a eng
|2 ISO 639-2
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989 |
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|b SBA
|a Springer Book Archives -2004
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|a 10.1007/978-3-642-45936-8
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856 |
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|u https://doi.org/10.1007/978-3-642-45936-8?nosfx=y
|x Verlag
|3 Volltext
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|a 620
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|a This bookis intended to be of assistance to the physicist or engineer concerned with designing and building electron devices such as high-vacuum transmitter- or amplifier tubes, gas- or vapor-filled rectifiers, thyratrons, X-ray or luminescent tubes, glow or incandescent lamps, Geiger- or ionization counters, vacuum photo cells, photoconductive cells, selenium-, germanium- or silicon rectifiers or trans istors. For this purpose, extensive information is required concerning the compo sition, behavior and handling of materials as well as a thorough knowledge of high-vacuum technique necessary for processing electron devices after their assembly. The text covers the preparation and working of materials used in these devices; the finishing methods for vacuum tubes (especially degassing, pumping and getter procedures); and different production steps of solid state devices. This book contains about 2300 references indicated in the text by the author's name and reference number. At the end of each chapter the references themselves are listed alphabetically by the author's name and with the title sometimes abbreviated. In accordance with the purpose of the book, "first" publications are quoted only when they contain up-to-date-knowledge of the subject in question. Patents are treated as references. The quotation of a patent gives only a hint of the technical details described there. Mentioning, or not mentioning, a patent does not imply a statement concerning its importance or validity or warning against imitation. Expired patents are named in addition to ones still valid
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