Electronic Equipment Packaging Technology
The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, man...
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| Format: | eBook |
| Language: | English |
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New York, NY
Springer US
1992, 1992
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| Edition: | 1st ed. 1992 |
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| Online Access: | |
| Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Table of Contents:
- 1 Packaging Implementation
- 1.1 Related General Packaging Issues
- 1.2 Levels of Packaging
- 1.3 Design Implementation Team
- 1.4 Product Applications
- 1.5 Packaging Priorities
- References
- 2 Integrated Circuits
- 2.1 Process Technology
- 2.2 Application-Specific Integrated Circuits
- References
- 3 Circuit Component Packages
- 3.1 Electronic Circuit Components
- 3.2 Electromechanical Circuit Components
- 3.3 Mechanical Circuit Component Hardware
- References
- 4 Multiple Bare Die Packaging Technologies
- 4.1 Bare-Die Termination Techniques
- 4.2 Hybrid Microcircuits
- 4.3 Chip-on-Board Technology
- 4.4 Multichip Modules
- References
- 5 Packaged Component Subassemblies
- 5.1 Electrical Performance
- 5.2 Packaging and Interconnecting (P&I) Structures
- 5.3 General Assembly Selection Considerations
- 5.4 Through-hole Technology
- 5.5 Surface Mount Technology (SMT)
- References
- 6 Subassembly Interconnection Systems
- 6.1 Backplane Structures
- 6.2 Backplane Connectors
- 6.3 Discrete Solderless-wrap Backplane Wiring
- References
- 7 Wiring and Cabling Assemblies
- 7.1 Electrical Characteristics
- 7.2 Wire and Cable Materials
- 7.3 Wire and Cable Configurations
- 7.4 Cabling Connectors
- 7.5 Wire Terminations
- References
- 8 Electronic Equipment Enclosures
- 8.1 General Enclosure Selection Considerations
- 8.2 Cabinets
- 8.3 Small Equipment Enclosures
- 8.4 Portable Carrying Cases
- 8.5 Printed Board Enclosures
- References
- 9 Thermal Management
- 9.1 Basic Thermal Management Considerations
- 9.2 General Thermal Analysis
- 9.3 Heat Sinks
- 9.4 Air Movers (Fans and Blowers
- 9.5 Liquid Cooling
- 9.6 Thermoelectric Heat Pump Modules
- References
- 10 End Product Applications
- 10.1 Consumer Electronics
- 10.2 Data Processing Equipment (Computers)
- 10.3 Aircraft (Avionics) Equipment
- 10.4 Military Shipboard Electronics
- 10.5 Biomedical Electronics
- References