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140122 ||| eng |
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|a 9781461534167
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| 100 |
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|a Mittal, K.L.
|e [editor]
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| 245 |
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|a Metallized Plastics 3
|h Elektronische Ressource
|b Fundamental and Applied Aspects
|c edited by K.L. Mittal
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| 250 |
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|a 1st ed. 1992
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| 260 |
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|a New York, NY
|b Springer US
|c 1992, 1992
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| 300 |
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|a IX, 400 p
|b online resource
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|a Interactions of Deposited Copper on COOH of 11-Mercaptoundecanoic Acid: An XPS Study -- XPS Investigation of the Interfacial Chemistry of Evaporated Silver on Plasma-Modified Polystyrene -- The Chemistry of Metal/Polymer Interface Formation: Relevance to Adhesion -- III. Plastic Surface Modifications -- A Study of Metallized Thermoplastic Films Following Gas Plasma Treatment -- Influence of Surface Treatments on the Metallization of Thermostable Polymers -- Oxygen Plasma Treatment of Fluorinated Polyimide: An X-ray Photoelectron Spectroscopy Study -- A Static SIMS Study of the Chemical Modifications Induced by Plasma and Flame Treatments at the Surface of Polyolefins -- Aluminium Metallization of Polypropylene Films Pretreated by a N2 or NH3 Nonequilibrium Plasma. Study of the Interface and Adhesion Measurements.-Aluminum Metallization of Polyimide Substrate -- IV. Adhesion Aspects of Metallized Plastics -- Adhesion Enhancement Using Ion Processing: Metallized Plastics --
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|a The Influence of the Pretreatment on the Adhesion of Metallic Coatings on Plastics -- Effect of the Polymeric Substrate Temperature on the Adhesion and Morphology of Metal Layers -- An Electrochemical Means of Probing a Metal/Polymer Interface- -A Method for Deducing Mechanical and Chemical Adhesion Components -- Measurement and Control of Interface Strength and Mechanical Properties of Coatings by Laser Spallation Experiment -- The Adhesion Strength of Metal/Polyimide and Polyimide/Silicon Interfaces as Determined by the Blister Test -- Non-destructive Evaluation of Adhesion at Metal-Insulator Interfaces Based on Extremely-Low-Frequency Dielectric Spectroscopy -- About the Contributors
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|a I. Metallization Techniques and Properties of Metal Deposits -- The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards -- Photoselective Circuitization of Dielectrics Via Electroless Plating of Metals -- Plasma-Induced Deposition of Copper Films -- The Effects of Substrate Functional Groups on Conventional and Novel E1ectroless Catalysts -- Laser Speckle Detection of Surface Morphology in Molded Plastic Parts -- Development of a Generic Method to Metallize Plastics -- Palladium and Aluminum Thin Film Deposition on Thermally Sensitive Substrates from Organometallic Complexes -- Application of Metallized Plastic Electrodes for Electrowinning of Metals -- II. Investigation of Interfacial Interactions -- Model Studies of the Interface Between Metals and Polyimides -- Scanning Tunneling Microscopy of Metal/Polymer Interfaces -- “In Situ” XPS Investigation of Polymers Metallized by Evaporation -- Model Systems for the Cr/Polyimide Interface --
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| 653 |
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|a Physical chemistry
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| 653 |
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|a Inorganic chemistry
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| 653 |
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|a Polymers
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| 653 |
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|a Chemistry, Organic
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| 653 |
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|a Physical Chemistry
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| 653 |
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|a Electrochemistry
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| 653 |
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|a Inorganic Chemistry
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| 653 |
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|a Materials / Analysis
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| 653 |
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|a Characterization and Analytical Technique
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| 653 |
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|a Organic Chemistry
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| 041 |
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7 |
|a eng
|2 ISO 639-2
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| 989 |
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|b SBA
|a Springer Book Archives -2004
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| 028 |
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|a 10.1007/978-1-4615-3416-7
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| 856 |
4 |
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|u https://doi.org/10.1007/978-1-4615-3416-7?nosfx=y
|x Verlag
|3 Volltext
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| 082 |
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|a 541.37
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| 520 |
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|a This volume chronicles the proceedings of the Third Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the auspices of the Dielectric Science and Technology Division of the Electrochemical Society in Phoenix, Arizona, October 13-18, 1991. This series of symposia to address the subject of metallized plastics was initiated in 1988 and the premier symposium was held in Chicago, October 10-12, 1988, followed by the second event in Montreal, Canada, May 7-10, 1990. The rroceedings of these two symposia have been properly documented ,2. The third symposium was a huge success like the previous two events, and all this is testimonial to the brisk interest and high tempo of R&D activity in the fie14 of metallized plastics. This further bolsters our earlier thinking that there was a conspicuous need to hold symposia on this topic on a regular basis and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. The study of metallized plastics constitutes an important human endeavor l and as pointed out earlier there are myriad applications of metallized plastics ranging from very commonplace to exotic. Also a survey of the recent literature will reveal that both the fundamental and applied aspects of metallized plastics are being pursued with great vigor
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