Multichip Module Technologies and Alternatives: The Basics
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to imp...
| Main Authors: | , |
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| Format: | eBook |
| Language: | English |
| Published: |
New York, NY
Springer US
1993, 1993
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| Edition: | 1st ed. 1993 |
| Subjects: | |
| Online Access: | |
| Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Table of Contents:
- The Framework
- 1 Introduction
- 2 MCM Package Selection: A Materials and Manufacturing Perspective
- 3 MCM Package Selection: A Systems Need Perspective
- 4MCM Package Selection: Cost Issues
- B: The Basics
- 5 Laminate-Based Technologies for Multichip Modules
- 6 Thick Film and Ceramic Technologies for Hybrid Multichip Modules
- 7 Thin Film Multilayer Interconnection Technologies for Multichip Modules
- 8 Selection Criteria For Multichip Module Dielectrics
- 9 Chip-to-Substrate (First Level) Connection Technology Options
- 10 MCM-to-Printed Wiring Board (Second Level) Connection Technology Options
- 11 Electrical Design of Digital Multichip Modules
- 12 Thermal Design Considerations for Multichip Module Applications
- 13 Electrical Testing of Multichip Modules
- C: Case Studies661
- 14 The Development of Unisys Multichip Modules
- 15 High Performance Aerospace Multichip Module Technology Development at Hughes
- 16 Silicon-Based Multichip Modules
- 17 The Tech