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Interconnect Technology and Design for Gigascale Integration

Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in t...

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Bibliographic Details
Other Authors: Davis, Jeffrey A. (Editor), Meindl, James D. (Editor)
Format: eBook
Language:English
Published: New York, NY Springer US 2003, 2003
Edition:1st ed. 2003
Subjects:
Electronics And Microelectronics, Instrumentation
Computer-aided Engineering (cad, Cae) And Design
Electrical And Electronic Engineering
Electrical Engineering
Electronic Circuits
Computer-aided Engineering
Electronics
Electronic Circuits And Systems
Online Access:
Collection: Springer Book Archives -2004 - Collection details see MPG.ReNa
Table of Contents:
  • 1. Interconnect Opportunities for GSI
  • 1.1 Introduction
  • 1.2 The Interconnect Problem
  • 1.3 Reverse Scaling
  • 1.4 System-on-Chip
  • 1.5 Three-Dimensional Integration
  • 1.6 Input/Output Interconnect Enhancements
  • 1.7 Photonic Interconnects
  • 1.8 Conclusions
  • 2. Copper BEOL Interconnects for Silicon CMOS Logic Technology
  • 2.1 Introduction
  • 2.2 BEOL Evolution
  • 2.3 The Case for Copper
  • 2.4 Electroplating of Cu
  • 2.5 Reliability of Cu Interconnects
  • 2.6 Processing of Cu Interconnects
  • 2.7 Summary
  • 3. Interconnect Parasitic Extraction of Resistance, Capacitance, and Inductance
  • 3.1 Introduction
  • 3.2 Electromagnetic Formulation
  • 3.3 Resistance Extraction
  • 3.4 Capacitance Extraction
  • 3.5 Inductance Extraction
  • 3.6 Summary
  • 4. Distributed RC and RLC Transient Models
  • 4.1 Introduction
  • 4.2 Distributed RC Models
  • 4.3 Distributed RLC Models
  • 4.4 Non-Ideal Return Paths
  • 4.5 Summary
  • 5. Power, Clock, and Global Signal Distribution
  • 5.1 Introduction
  • 5.2 Global Signal Interconnect Modeling
  • 5.3 Global Clock Distribution Modeling
  • 5.4 Global Power Distribution Modeling
  • 5.5 An Integrated Architecture for Global Interconnects
  • 5.6 Conclusions
  • 6. Stochastic Multilevel Interconnect Modeling and Optimization
  • 6.1 Introduction
  • 6.2 Wire-Length Distribution Model
  • 6.3 Net Model Approximation
  • 6.4 Comparisons with Actual Data
  • 6.5 Critical Path Model
  • 6.6 Dynamic Power Dissipation Model
  • 6.7 Optimal n-Tier Multilevel Interconnect Architectures
  • 6.8 Summary
  • 7. Interconnect-Centric Computer Architectures
  • 7.1 Introduction and Motivation
  • 7.2 Interconnect-Aware Architectures
  • 7.3 Interconnect Demand Models
  • 7.4 Related Work
  • 7.5 GENESYS Organization and Models
  • 7.6 Heterogeneous Architecture Models
  • 7.7 System Design Analysis
  • 7.8 Wire Demands andtheir Relation to Architecture
  • 7.9 Conclusion
  • 8. Chip-to-Module Interconnect
  • 8.1 Introduction
  • 8.2 Packaging and Chip-to-Module Trends
  • 8.3 Microvia Printed Wiring Board Technologies
  • 8.4 Chip-to-Module Interconnections for GSI
  • 9. 3-D ICs DSM Interconnect Performance Modeling and Analysis
  • 9.1 Introduction
  • 9.2 Motivation for 3-D ICs
  • 9.3 Scope of This Study
  • 9.4 Area and Performance Estimation of 3-D ICs
  • 9.5 Challenges for 3-D ICs
  • 9.6 mplications for Circuit Design and System-on-a-Chip Applications
  • 9.7 Overview of 3-D IC Technology
  • 9.8 Conclusions
  • 10. Silicon Microphotonics
  • 10.1 Introduction
  • 10.2 Optical Interconnection
  • 10.3 Monolithic Silicon Microphotonics
  • 10.4 Optical Clock Distribution and Data I/O
  • 10.5 Summary

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