Thyristor Physics
In this volume I attempt to present concisely the physical principles underlying the operation and performance characteristics of the class of semiconductor p-n-p-n switches known as thyristors. The semiconductor controlled rectifier (SCR), the triode AC switch (Triac) the gate turn-off switch (GTO)...
Main Author: | |
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Format: | eBook |
Language: | English |
Published: |
New York, NY
Springer New York
1976, 1976
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Edition: | 1st ed. 1976 |
Series: | Applied Physics and Engineering, An International Series
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Subjects: | |
Online Access: | |
Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Table of Contents:
- 5.3 Charge-control model of a p-n-p-n structure
- 5.4 Delay time
- 5.5 Rise time with a resistive load
- 5.6 Rise time with inductive load
- 5.7 Propagation of the on state
- 6 The Nongated, Undesirable Thyristor Triggering
- 6.1 Introduction
- 6.2 Thermal turn on
- 6.3 Light triggering
- 6.4 Voltage triggering
- 7 Thyristor Voltage Drop in the On State
- 7.1 Introduction
- 7.2 Herlet’s closed-form p-i-n diode analysis
- 7.3 Kokosa’s numerical analysis
- 7.4 Numerical analysis of Cornu and Lietz
- 7.5 Otsuka’s forward-drop analysis
- 8 SCR Turn-off Transient
- 8.1 Introduction
- 8.2 Storage time ts1
- 8.3 Fall time tf1
- 8.4 Storage time ts2
- 8.5 Fall time tf2
- 8.6 Effect of the gate current
- 8.7 Simplified approaches
- 8.8 Experimental data
- 9 Gate Turn-off Thyristor (GTO)
- 9.1 Introduction
- 9.2 Plasma-pinchingmechanism
- 9.3 Turn-off velocity
- 9.4 Pinching (focusing) time and turn-off gain
- 9.5 Maximum anode and gate currents
- 9.6 Plasma-pinching in the ungated n base
- 9.7 Theoretical model compared with experiment
- 10 Thyristor di/dt and Current Pulse Capability
- 10.1 Introduction
- 10.2 Test circuit for gate-triggered di/dt
- 10.3 Initial turn-on region
- 10.4 di/dt capability of the gated and nongated turn on
- 10.5 Localized temperature rise for a short single pulse
- 10.5 Temperature rise for long or recurrent pulses
- 10.7 Temperature rise and transient thermal impedance during turn-on spreading
- 10.8 Methods of increasing the initial turn-on area
- 10.9 Emitter gate
- 10.10 Emitter shorts versus the turn-on time
- 10.11 Beam-fired thyristor
- 10.12 Field-controlled thyristor
- 11 Bidirectional p-n-p-n Switches
- 11.1 Introduction
- 11.2 Bidirectional p-n-p-n diode switch
- 11.3 Current distribution across a forward-biased junction bounded by resistive layers (current-crowding effect)
- 11.4 Junction gate
- 11.5 Remote gate
- 11.6 Triac
- 12 Commutation of Triacs
- 12.1 Introduction
- 12.2 Current and voltage waveforms during commutation
- 12.3 Role of stored charges in triac commutation
- 12 A Recovery of a p+ -n abrupt-junction diode
- 12.5 Snubber networks for dv/dt suppression
- 13 Silicon Surface
- 13.1 Introduction
- 13.2 Ideal MOS diode
- 13.3 Silicon surf ace states and charges
- 14 Avalanche Breakdown Enhancement by Mesa Contouring
- 14.1 Introduction
- 14.2 Positive and negative bevel angles
- 14.3 Theoretical approach to the field computation in the depletion region
- 14.4 Negative bevel angle
- 14.5 Positively beveled junctions
- 14.6 Novel approaches to beveling
- 15 Planar-Junction Avalanche Breakdown Improvement
- 15.1 Introduction
- 15.2 Diffused guard ring
- 15.3 Junction field plate, annular ring, and channel stopper
- 15.4 Resistive field plate
- 15.5 p-n junction with field limiting rings
- 15.6 Etch-contoured planar junctions
- 16 Thyristor Thermal Response
- 16.1 Introduction
- 1 Device basics
- 1.1 Introduction
- 1.2 SCR current-voltage characteristics
- 1.3 Basic SCR construction features
- 1.4 Gate triggering
- 1.5 Holding current
- 1.6 Triggering a shorted emitter SCR
- 2 Current Gain
- 2.1 Variation of current gain with current
- 2.2 Current gain measurement
- 3 Thyristor Maximum Voltage Blocking Capability
- 3.1 Introduction
- 3.2 Maximum forward-blocking capability VBO
- 3.3 Maximum reverse-blocking capability
- 3.4 The punch-through condition
- 3.5 Temperature dependence
- 3.6 Surface breakdown
- 3.7 Reverse-conducting thyristor
- 4 Some High-Injection-Level Effects
- 4.1 Introduction
- 4.2 Ambipolar mobility and diffusivity
- 4.3 Mobility and diffusivity versus current density
- 4.4 Lifetime at high injection levels
- 4.5 High-low junctions at high current densities
- 4.6 Current gain fall-off
- 5 The Gate-Triggered SCR Turn-On Transient
- 5.1 Introduction
- 5.2 Charge-control model of a bipolar transistor
- 16.2 Heat generation and absorption in the forward-biased thyristor
- 16.3 Determination of junction temperature
- 16.4 Generalized concept of thermal impedance
- 16.5 Device temperature response to an arbitrary power waveshape
- 16.6 Thyristor thermal impedance measurement
- 16.7 Computer-aided thermal analysis
- 17 Thyristor Circuits Basics
- 17.1 Introduction
- 17.2 SCR and triac control and triggering methods
- 17.3 Thyristor triggering devices
- 17.4 Commutation
- 17.5 Effect of an impedance between the gate and cathode of a thyristor
- 17.6 Thyristor protection circuits
- 17.7 Some thyristor applications