Thyristor Physics

In this volume I attempt to present concisely the physical principles underlying the operation and performance characteristics of the class of semiconductor p-n-p-n switches known as thyristors. The semiconductor controlled rectifier (SCR), the triode AC switch (Triac) the gate turn-off switch (GTO)...

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Bibliographic Details
Main Author: Blicher, A.
Format: eBook
Language:English
Published: New York, NY Springer New York 1976, 1976
Edition:1st ed. 1976
Series:Applied Physics and Engineering, An International Series
Subjects:
Online Access:
Collection: Springer Book Archives -2004 - Collection details see MPG.ReNa
Table of Contents:
  • 5.3 Charge-control model of a p-n-p-n structure
  • 5.4 Delay time
  • 5.5 Rise time with a resistive load
  • 5.6 Rise time with inductive load
  • 5.7 Propagation of the on state
  • 6 The Nongated, Undesirable Thyristor Triggering
  • 6.1 Introduction
  • 6.2 Thermal turn on
  • 6.3 Light triggering
  • 6.4 Voltage triggering
  • 7 Thyristor Voltage Drop in the On State
  • 7.1 Introduction
  • 7.2 Herlet’s closed-form p-i-n diode analysis
  • 7.3 Kokosa’s numerical analysis
  • 7.4 Numerical analysis of Cornu and Lietz
  • 7.5 Otsuka’s forward-drop analysis
  • 8 SCR Turn-off Transient
  • 8.1 Introduction
  • 8.2 Storage time ts1
  • 8.3 Fall time tf1
  • 8.4 Storage time ts2
  • 8.5 Fall time tf2
  • 8.6 Effect of the gate current
  • 8.7 Simplified approaches
  • 8.8 Experimental data
  • 9 Gate Turn-off Thyristor (GTO)
  • 9.1 Introduction
  • 9.2 Plasma-pinchingmechanism
  • 9.3 Turn-off velocity
  • 9.4 Pinching (focusing) time and turn-off gain
  • 9.5 Maximum anode and gate currents
  • 9.6 Plasma-pinching in the ungated n base
  • 9.7 Theoretical model compared with experiment
  • 10 Thyristor di/dt and Current Pulse Capability
  • 10.1 Introduction
  • 10.2 Test circuit for gate-triggered di/dt
  • 10.3 Initial turn-on region
  • 10.4 di/dt capability of the gated and nongated turn on
  • 10.5 Localized temperature rise for a short single pulse
  • 10.5 Temperature rise for long or recurrent pulses
  • 10.7 Temperature rise and transient thermal impedance during turn-on spreading
  • 10.8 Methods of increasing the initial turn-on area
  • 10.9 Emitter gate
  • 10.10 Emitter shorts versus the turn-on time
  • 10.11 Beam-fired thyristor
  • 10.12 Field-controlled thyristor
  • 11 Bidirectional p-n-p-n Switches
  • 11.1 Introduction
  • 11.2 Bidirectional p-n-p-n diode switch
  • 11.3 Current distribution across a forward-biased junction bounded by resistive layers (current-crowding effect)
  • 11.4 Junction gate
  • 11.5 Remote gate
  • 11.6 Triac
  • 12 Commutation of Triacs
  • 12.1 Introduction
  • 12.2 Current and voltage waveforms during commutation
  • 12.3 Role of stored charges in triac commutation
  • 12 A Recovery of a p+ -n abrupt-junction diode
  • 12.5 Snubber networks for dv/dt suppression
  • 13 Silicon Surface
  • 13.1 Introduction
  • 13.2 Ideal MOS diode
  • 13.3 Silicon surf ace states and charges
  • 14 Avalanche Breakdown Enhancement by Mesa Contouring
  • 14.1 Introduction
  • 14.2 Positive and negative bevel angles
  • 14.3 Theoretical approach to the field computation in the depletion region
  • 14.4 Negative bevel angle
  • 14.5 Positively beveled junctions
  • 14.6 Novel approaches to beveling
  • 15 Planar-Junction Avalanche Breakdown Improvement
  • 15.1 Introduction
  • 15.2 Diffused guard ring
  • 15.3 Junction field plate, annular ring, and channel stopper
  • 15.4 Resistive field plate
  • 15.5 p-n junction with field limiting rings
  • 15.6 Etch-contoured planar junctions
  • 16 Thyristor Thermal Response
  • 16.1 Introduction
  • 1 Device basics
  • 1.1 Introduction
  • 1.2 SCR current-voltage characteristics
  • 1.3 Basic SCR construction features
  • 1.4 Gate triggering
  • 1.5 Holding current
  • 1.6 Triggering a shorted emitter SCR
  • 2 Current Gain
  • 2.1 Variation of current gain with current
  • 2.2 Current gain measurement
  • 3 Thyristor Maximum Voltage Blocking Capability
  • 3.1 Introduction
  • 3.2 Maximum forward-blocking capability VBO
  • 3.3 Maximum reverse-blocking capability
  • 3.4 The punch-through condition
  • 3.5 Temperature dependence
  • 3.6 Surface breakdown
  • 3.7 Reverse-conducting thyristor
  • 4 Some High-Injection-Level Effects
  • 4.1 Introduction
  • 4.2 Ambipolar mobility and diffusivity
  • 4.3 Mobility and diffusivity versus current density
  • 4.4 Lifetime at high injection levels
  • 4.5 High-low junctions at high current densities
  • 4.6 Current gain fall-off
  • 5 The Gate-Triggered SCR Turn-On Transient
  • 5.1 Introduction
  • 5.2 Charge-control model of a bipolar transistor
  • 16.2 Heat generation and absorption in the forward-biased thyristor
  • 16.3 Determination of junction temperature
  • 16.4 Generalized concept of thermal impedance
  • 16.5 Device temperature response to an arbitrary power waveshape
  • 16.6 Thyristor thermal impedance measurement
  • 16.7 Computer-aided thermal analysis
  • 17 Thyristor Circuits Basics
  • 17.1 Introduction
  • 17.2 SCR and triac control and triggering methods
  • 17.3 Thyristor triggering devices
  • 17.4 Commutation
  • 17.5 Effect of an impedance between the gate and cathode of a thyristor
  • 17.6 Thyristor protection circuits
  • 17.7 Some thyristor applications