Three Dimensional System Integration IC Stacking Process and Design
Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...
| Other Authors: | , , |
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| Format: | eBook |
| Language: | English |
| Published: |
New York, NY
Springer US
2011, 2011
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| Edition: | 1st ed. 2011 |
| Subjects: | |
| Online Access: | |
| Collection: | Springer eBooks 2005- - Collection details see MPG.ReNa |
Table of Contents:
- The next step in system integration: the benefits of going 3-D
- Process technology for manufacturing Through-Silicon Vias (TSVs)
- Alternative 3D integration schemes
- Manufacturing issues in 3D stacked ICs
- TSV characterization
- Physical design of 3D stacked ICs
- DRAM on logic stacking
- 3D general purpose micro-processors
- 3D system design: a holistic design approach