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00782nmm a2200169 u 4500 |
001 |
EB000308021 |
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EBX01000000000000000106874 |
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00000000000000.0 |
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cr||||||||||||||||||||| |
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110826 ||| |
020 |
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|a 0780387449
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245 |
0 |
0 |
|a 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004.
|h Elektronische Ressource
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260 |
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|a New York
|b The Institute of Electrical and Electronics Engineers, Inc.
|c 2004
|
653 |
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|a Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics; Components, Circuits, Devices and Systems
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989 |
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|b IEEEPROC
|a IEEE Conference Proceedings
|
856 |
4 |
0 |
|u https://ieeexplore.ieee.org/servlet/opac?punumber=9621
|x Verlag
|3 Volltext
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082 |
0 |
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|a 600
|